NEWS !
Conexant Debuts Industry's First Single-Chip, Multiport
Line Interface Units for High-Bandwidth Communications
Business Wire - March 30, 1999 06:21
NEWPORT BEACH, Calif.--(BUSINESS WIRE)--March 30, 1999--
Conexant delivers low-cost, low-power solution for communication equipment suppliers to implement
next-generation network access services
Conexant Systems Inc. (Nasdaq:CNXT) Tuesday announced a family of two- and three-channel line
interface units (LIUs) designed to support high-bandwidth communications applications.
Consisting of independent data transceivers capable of operating over coaxial cable at the E3 rate of
34.368 Mbs, the DS3 rate of 44.736 Mbs and the STS-1 rate of 51.84 Mbs, these LIUs let
communications equipment manufacturers implement high-speed communications protocols at
significantly lower power and cost than alternative solutions. These devices enhance Conexant's broad
offering of semiconductor system solutions for such increasingly complex and cost-sensitive
multi-service network access products as digital cross-connect systems, high-end routers, ATM
switches, channelized line aggregation units, channel server units and multiplexers.
Conexant's new LIUs incorporate the company's mixed-signal CMOS process technology and
systems expertise to deliver a high-density, low-power solution that reduces parts count and board
space while achieving the industry's lowest cost per port. They also incorporate Conexant's expertise
as one of the largest suppliers of ICs for T1/E1 digital data communications over twisted-pair copper
wire, including T1/E1 LIUs and framers, a channelized HDLC or ISDN link layer controller, and a
multiprotocol communications controller that provides a complete physical and link layer solution in just
two chips. These devices can be used as a data transceiver for up to 1,350 feet of coaxial cable in an
on-premises environment, exceeding the reach of competitive devices.
Conexant has used a proprietary, advanced CMOS process for its DS3/E3/STS-1 LIUs that allows
the integration of precision analog signal processing with high-speed digital circuitry into a 40 to 50
percent lower-power and significantly lower-cost solution than competitive alternatives. These devices
provide the physical layer interface between a data source and framer or other terminal-side
equipment, and the electrical cable used for data transmission. By effectively integrating two or three
independent data transceivers onto a single chip, these products provide unmatched economies of
scale for concentrator applications in which two or three DS3 or STS-1 channels are concentrated into
a single STS-3 channel. This integration also reduces the number of external components required,
saving valuable board space.
"The growth in demand for voice and data services is continuing to raise the bar for bandwidth, port
density and flexibility in the network infrastructure," said Jeremy Bicknell, physical layer product
manager for Conexant's Network Access Division. "As users transition from T1/E1 services to
higher-speed services like T3/DS3, E3 and STS-1, equipment suppliers need higher port density at
these high-speed rates. With its multi-standard design and easy programmability, Conexant's product
provides the ideal solution for OEMs worldwide to implement next-generation solutions for
multi-service network access."
Transmit LIU Features
The use of programmable pulse filtering in each independent transmit section simplifies system
implementation by ensuring full compliance with ANSI T1.102-1993 cross-connect pulse-mask
standards. Independent on-chip band gap references are included to enable precise pulse shape
generation. The large dynamic range and minimal requirement for external components reduces cost
and complexity of test and monitoring functions in a typical DS3 or E3 front-end design.
Receive LIU Features
The receiver sections for each port are completely separate and feature automatic gain control
provided by a variable gain amplifier, clock recovery phase-locked loop (PLL), adaptive receive
equalizer and signal slicer. The sophisticated receive equalizer automatically adapts to different cable
types, such as type 734 and 728, as well as flat loss introduced by many in-service testing and
redundant cabling configurations.
In addition, these devices feature alarms for coding violations and loss of signal, a built-in B3ZS/HDB3
encoder/decoder, as well as full loopback capability. On-chip facilities for network management and
test eliminate the need for external circuitry. In effect, significant external components have been
eliminated, with the exception of coupling transformers, termination resistors and supply bypass
capacitors. Both devices meet interoperability requirements as defined by the Bellcore GR499 and
GR253 jitter specifications.
Conexant's growing family of network-access solutions provides equipment designers with a broad
portfolio of interoperable silicon system solutions for next-generation multiservice network-access
products. This portfolio encompasses 56Kbps central-site modems, digital subscriber line (DSL), as
well as T1/E1 and T3/E3/DS3/STS-1 components at the physical level. It also includes asynchronous
transfer mode (ATM) devices for connection to the corporate or Internet backbone, and high-speed
network interface devices for attaching to the LAN and WAN.
Price & Availability
Samples of the CN8332 and CN8333 are available now, and both are packaged in an 80-pin
ETQFP. They operate with a single 3.3V power supply, and feature a -40 to +85 C temperature
range. The CN8332 is priced at $42 in OEM quantities and the CN8333 is priced at $55 in OEM
quantities. Evaluation boards consisting of the CN8333 in conjunction with the Bt8330 (single chip
DS3/E3 framer in 80-pin MQFP) are available to assist in hardware development of stand-alone
applications as well as supporting rapid development of a complete DS3/E3 subsystem.
Conexant Systems Inc. is the $1.2 billion company that was created when Rockwell International spun
off its semiconductor systems business to shareowners in December 1998. Conexant is the world's
largest independent company focused exclusively on providing semiconductor products for
communications electronics. The company aligns its business into five product platforms: Personal
Computing, Personal Imaging, Wireless Communications, Digital Infotainment and Network Access.
With more than 30 years of experience in developing analog modem technology, the company
leverages its expertise in mixed-signal processing and communications technology to deliver integrated
systems and semiconductor products for a broad range of communications applications. These
products facilitate communications worldwide through wireline voice and data communications
networks, cordless and cellular wireless telephony systems, and emerging cable and wireless
broadband communications networks.
Certain matters discussed in this news release regarding future network access products may constitute
forward-looking statements, such as discussions of product release dates, product availability, market
acceptance and customer demand. Such forward-looking statements involve certain risks and
uncertainties, including the timely release of products by manufacturing suppliers, the availability of
components and technologies from partners, suppliers and licensors, the acceptance of applicable
technologies, the impact of competitive markets, products and pricing, and other risks detailed from
time to time in the company's SEC reports, including the reports on Form 10-Q for the quarter ending
January 1, 1999. Actual results may vary materially.
Note to Technology Editors: Please see glossary below for definition of terms used in this release.
Definitions of Terms
CMOS: Complementary Metal Oxide Semiconductor. An integrated circuits manufacturing technology
known for requiring less electricity than other methods.
HDLC: High-level Data Link Control. An ITU-TSS link layer protocol standard for point-to-point and
multi-point communications.
T1: Digital transmission link (level 1) with a capacity of 1.544 Mbps and is the standard for N.
America. T1 uses two pairs of normal twisted wires, the same as you'd find in your house. T1 normally
can handle 24 voice conversations with each conversation being digitized at 64 Kbps but with more
advanced digital voice encoding techniques, it can handle more voice channels.
E1: Digital transmission link (level 1) with a capacity of 2.048 Mbps and is the standard for Europe.
T3: Digital transmission link (level 3) with a capacity of 44.736 Mbps and is the standard for N.
America. Capable of handling 672 voice conversations. T3 runs on fiber optic and is further up the
digital carrier hierarchy.
E3: Digital transmission link (level 3) with a capacity of 34.368 Mbps and is the standard for Europe.
DS3: Digital signal level 3. The N. American digital hierarchy signaling standard for transmission at
44.736 Mbps that is used by T3 carrier. Supports 28 DS1s plus overhead.
ISDN: Integrated Services Digital Network. An international standard that defines a digital end-to-end
network operating at 1.544 Mbps or slower and supports voice, data, image and video
simultaneously.
ITU: International Telecommunications Union. An international body of member countries whose task
is to define recommendations and standards relating to the international telecommunications industry.
STS-1: Synchronous Transfer Signal (level 1); SONET standard for transmission over OC-1 optical
fiber at 51.84 Mbps.
STS-3: Synchronous Transfer Signal (level 3); SONET standard for transmission over OC-3 optical
fiber at 155.84 Mbps.
SONET: Synchronous Optical Network. An ANSI (American National Standards Institute) standard
for transmitting information over optical fiber. This standard is used/accepted in the US, Canada and is
a variation of the SDH International standard.
SDH: Synchronous Digital Hierarchy. The ITU-TSS International standard for transmitting information
over optical fiber.
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