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Technology Stocks : Texas Instruments - Good buy now or should we wait? -- Ignore unavailable to you. Want to Upgrade?

To: Patriarch who wrote (4343)	3/21/1999 1:02:00 PM
From: Patriarch	Respond to of 6180

Industry's First 0.15-Micron Effective Digital Baseband Device Samples Available From Texas Instruments Advanced Process Technology Enables Faster, More Highly Integrated DSP Solutions for TI Customers DALLAS, (Mar. 16, 1999) -- Continuing its leadership in high-performance digital signal processor (DSP) solutions, Texas Instruments announced today that it has shipped samples of the industry's first digital baseband product with transistor feature sizes of 0.15-micron Effective or 0.18-micron drawn. The device, a highly integrated DSP has been successfully demonstrated in a wireless application. By offering improved power, cost, and space savings, TI's technology will allow consumers to enjoy inexpensive, light-weight wireless phones that provide even longer talk and standby times than currently available today. "With 0.15-micron CMOS technology, TI is providing its customers with an important competitive advantage," said Bob Carl, Americas Marketing Manager, TI Wireless Communications Business Unit. "The high levels of integration and performance, along with the low power consumption of the new process will help TI wireless customers move seamlessly into next-generation technologies with features such as the converged delivery of voice, data and video." A leap ahead in integration and performance The success of the 0.15-micron capability, which correlates to the .18-micron process as defined by the SIA roadmap, means a leap forward in system-level integration and processing performance for TI customers, enabling them to dramatically increase the functionality and features of their products. Wireless handsets, for instance, can incorporate new algorithms for noise suppression, echo cancellation and other techniques that improve voice quality. Developers can also incorporate more functions in software, allowing them to update their products quickly through code changes for fast response to market demands. Additional benefits of TI's 0.15-micron technology include lower power consumption, reduced board space and the potential for system cost savings. The small die size resulting from the process, together with aggressive next-generation chip-scale packaging, reinforce the trend in integration toward creating complete systems only slightly larger than the silicon itself. The new .15-micron capability is now available to all of TI's ASIC customers as is the wide range of DSP and RISC processors contained within TI's TImeBuilder™ system-on-a-chip capability. Manufacturers of hard disk drives, modems, networking systems, telecommunications products, digital consumer devices and high-performance workstations will also benefit from the greater performance and integration that this technology brings. "TI is the recognized leader in providing system-level DSP solutions, and the 0.15-micron CMOS technology demonstrates once again that TI is also a leader in process," said Bob Carl. "TI continues to supply its customers with solutions that are not only comprehensive in integration, but at the leading edge of power and performance as well." Production plans The initial 0.15-micron digital baseband device integrates a TMS320C54x DSP, a microcontroller, ROM, SRAM, logic and analog functions on a single die, and is packaged in a 144-lead MicroStar(tm) ball grid array (BGA). The device has been demonstrated successfully in TI's first pass silicon with the new process and is the first product being manufactured at the Kilby Center, TI's advanced research center for silicon manufacturing. TI plans to sample other 0.15-micron devices to wireless and other customers during the second quarter of the year, with volume shipments expected to follow during the second half. Standard high-performance TMS320 DSP products are also scheduled for release in 0.15-micron technology during 1999. # # #