To: unclewest who wrote (17890 ) 3/27/1999 7:10:00 AM From: REH Respond to of 93625
LSI introduces ASIC cores for Direct Rambus Crista Souza Silicon Valley- LSI Logic Corp. has begun shipping ASIC-core samples that support the Direct Rambus interface, addressing high-speed systems that require fast signal propagation between chips. Characterized for LSI's 0.25-micron G11 process technology, the Direct Rambus ASIC Cell (D-RAC) cores play well into the company's target markets of consumer electronics, networking switches, and desktop computers, where rich graphics and communications protocols demand both fast internal-memory access and low cost. The chip maker said it is also working to port the D-RAC to its upcoming 0.18-micron G12 ASIC process, which is set to sample in the third quarter. LSI claims that with the release of the D-RAC core, it is the first ASIC supplier to offer Direct Rambus support. Other Rambus ASIC licensees include IBM Microelectronics, LG Semicon, Matsushita, NEC, Oki, Texas Instruments, and Toshiba. "Major players in multiple market segments are adopting Rambus technology, and we expect widespread usage in the near future," said Marc Miller, product marketing director for LSI, Milpitas, Calif. With signal pin rates of up to 800 Mbits/s and peak data rates of 1.6 Gbits/s, Direct Rambus technology is one of the highest-performance memory interfaces available. In addition, by designing multiple D-RACs into a single ASIC, customers can reduce pin count and lower overall system cost, according to the company. A D-RAC test chip achieved the full 800-MHz Direct Rambus speed, LSI said. LSI became a Rambus licensee in 1994, and has built a comprehensive set of tools and support for the technology. The D-RAC is the company's third-generation Rambus product.