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To: Zeev Hed who wrote (44468)	3/27/1999 2:35:00 PM
From: Fabeyes	Respond to of 53903

>>>The principles are exactly the same, it is the control of the process that has changed quite dramatically. >>>>>>>>>>>>>>>>>> That is true, but having a mobile ion in a Fab is dangerous, let alone dirty. The process of making the silicon and its lattice structure are not like using it to polish wafers, like CMP. One of the fears in the 80's was a disgruntled employee coming into the Fab with a handful of salt and shutting the company down. Does not seem to be as big of a concern down, with new equipment and design, which seals most of the active areas during some part of the process. It was just a learning curve for the "old" guard; so be kind to the elderly -- HA!! Just like getting rid of the contact masks used to make a 64K. Then the proximity aligners, which reminded me of a game; put this set of cross hairs into that one and PRESS THE BUTTON. No one would have believed designs down to a .18im. I can remember seeing a "roadmap" in 1983 talking about doing a .25um in 2003. Beat that by a little.