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To: Warpfactor who wrote (646)	3/31/1999 3:21:00 PM
From: Nevin S.	Read Replies (1) \| Respond to of 1214

Reason for recent downdraft. I think think this may have something to do with it. Everybody seems to be waiting on the eventual shift to 300 MM wafers, which by all accounts seems to be delayed once again. I have read bit and pieces here and there that indicate that maybe some of the Taiwanese foundaries will open 300 MM pilot lines later this year or early next. Message 8604829 Intel regularly meets with semiconductor equipment suppliers and had just such a meeting last week. ML: There were several important data points that came out of the meeting. First, there is no clear timetable for the 300mm at Intel. We think Intel's enthusiasm for 300mm technology at the operating level was squashed at the business level. Craig Barrett knows the pain of a wafer transition after managing the 150mm wafer transition at Intel in the mid-80's. We do not think Intel will move ahead with 300mm until it is economical and do not expect a decision until the 4 quarter at the earliest. Second, Intel now plans to qualify more than one vendor for each tool abandoning the gold plated “copy exact” strategy adopted 8 yeas ago.. Both these decisions are core to slowing the growth in depreciation expense- a top priority as the mix of MPU business moves to the lower end.