To: Tony Viola who wrote (18179 ) 4/2/1999 8:02:00 PM From: unclewest Read Replies (1) | Respond to of 93625
i do not want to be naive but there is a lot of good in that message.Samsung Electronics Co. Ltd., which is expected to manufacture much of the Direct RDRAM produced in the industry this year, acknowledged the bug but called it a non-issue. "Samsung's Rambus is fully functional and has been demonstrated to work in fully stable systems," said Avo Kanadjian, vice president of marketing for Samsung Semiconductor Inc., San Jose i have been hoping that samsung was the company that had rdram production right. they are the #1 dram mfr. if one can do it the others can too.Spokespeople and executives for three other DRAM companies-LG Semicon Co. Ltd., NEC Corp., and Toshiba Corp.-said they've received no communiquĊ½ regarding a Rambus flaw within the past few weeks. Toshiba, however, said it discovered a bug two months ago, since fixed, that triggered a power spike during Direct RDRAM's power-up sequence. does this mean that lg, nec and toshiba also have it right? what about the other 13 rambus rdram mfrs? did the reporter fail to do his full dd? or did he find no story there?A spokeswoman for Rambus Inc., Mountain View, Calif., said she had no knowledge of any deviant register bug in Direct RDRAM that statement seems pretty significant.Samsung said Intel notified it of the bug, which issues a "0" instead of a "1" during the DRAM's initialization sequence, but recommended a temporary, system-level software fix. Intel then advocated a hardware redesign during the next regularly scheduled Direct RDRAM die shrink, allowing companies to avoid the time and expense of an added mask-set revision. "Such a communication [was made by Intel], and indicated that there was a system-level work-around in place," Kanadjian said. "When the next planned die shrink is introduced, there was a recommendation that the change to Rambus be made then." sounds a lot like problem found and resolved to me.The change, though relatively small , would require a redesign of logic functions on the Rambus chip and could entail an all-layers mask redesign, they said. Even the smallest revision, if it involves making new masks for each of Direct RDRAM's 16 to 20 layers, would take three months to implement in silicon, and another three to qualify, chip makers agreed. cover your butt reporting...meaningless without substantiation. remember a reporters job is to create controversy. makes reading interesting. samsung got it right, so why all this verbage?In the event of such a delay, suppliers could still get a redesigned and qualified Rambus chip to market in the late fall, about the same time as the revised timetable set by Intel for introducing its Rambus-enabled Camino chipset. nuf said imo, if your long. unclewest