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Technology Stocks : Kulicke and Soffa -- Ignore unavailable to you. Want to Upgrade?

To: Darin who wrote (3268)	4/7/1999 1:12:00 PM
From: klaus pluszynski	Read Replies (1) \| Respond to of 5482

Sounds like good news from FlipChip: FOR IMMEDIATE RELEASE FLIP CHIP TECHNOLOGIES LICENSES WAFER BUMPING TECHNOLOGY TO ADVANCED SEMICONDUCTOR ENGINEERING, INC. PHOENIX, ARIZONA (April 6, 1999) - Flip Chip Technologies (FCT), L.L.C. announced today it has licensed its flip chip bumping to Advanced Semiconductor Engineering, Inc. (ASE) of Kaohsiung, Taiwan for advanced flip chip BGA packages. ASE is the first licensee of FCT's flip chip technology. The technology will be used primarily for devices which are to be assembled in ASE flip chip BGA packages. This agreement is the initial step in a strategic business relationship between ASE and FCT. ASE is the top IC packaging foundry in Taiwan and the second largest in the world. The company operates packaging and test facilities in Kaohsiung, Malaysia and the Philippines. ASE's focus is on packaging and testing of high pin-count products. By licensing FCT's flip chip bumping technology, ASE now has the ability to provide a single solution for bumping, packaging, and test. ASE evaluated a number of bumping suppliers before choosing FCT. One factor in the decision was FCT's process capability to achieve 150 micron pitch area array bumping for leading edge, high I/O silicon designs. With its proprietary solder paste technology, FCT is also planning to introduce multiple solder alloys, including high reliability non-lead solder alloys. Theta Ton, ASE's Vice President Packaging and Engineering, said, "This license agreement is in line with ASE's strategy to become the world's premier IC assembly, packaging and test house. By having flip chip bumping capability, we can enhance our service to customers with in-house technical support and short delivery lead times. We believe by selecting FCT, with their technical expertise and technology, we can attain our goal." According to Harry Hollack, President and CEO of FCT, "This license agreement is an important accomplishment to the advancement of FCT's technology in the Asian market. We are thrilled to be working with one of the fastest growing packaging companies in the world." This licensing agreement is FCT's second technology transfer contract in the past two months (see 2/24/99 release "CMD Signs Agreement with FCT".) FCT's solder bump interconnect structures facilitate advanced electronic packaging solutions such as wafer level chip size packages, flip chip on board--laminate, flex, or ceramic; and flip chip in package (BGAs and CSPs). Based in Phoenix, AZ, FCT is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry. A joint venture of Delphi Delco Electronics Systems and Kulicke & Soffa Industries, FCT offers proven merchant bumping services used in applications requiring higher performance, reduced form factor, and lower costs than those obtainable through traditional surface mount techniques. For more information on FCT and the ASE agreement, visit flipchip.com.