SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?


To: Yousef who wrote (55343)4/13/1999 7:03:00 PM
From: Process Boy  Read Replies (1) | Respond to of 1573213
 
Yousef - <But, I thought that AMD was going to be releasing the K7 using copper in '99.>

They won't listen. Don't you know that Dresden will be on line in Q3 of '99?

PB



To: Yousef who wrote (55343)4/13/1999 7:09:00 PM
From: Process Boy  Respond to of 1573213
 
Yousef - Cut and paste from the Q1 Earnings Release

Manufacturing Review
** During the quarter, Intel began production of its first product manufactured on 0.18 micron process technology. The first product produced on this new process is a mobile version of the Pentium II processor, which is expected to ship in the second quarter. The company plans to manufacture and ship new members of the Pentium III processor family manufactured on 0.18 micron process technology in the second half of 1999.


PB



To: Yousef who wrote (55343)4/13/1999 7:25:00 PM
From: Shane Geary  Read Replies (1) | Respond to of 1573213
 
Yousef,

re: "Hasn't there been 2-3 earnings warnings and a couple of "manufacturing problems" announcements since this article ?? "

Yes, but no direct relationship to anything in the article.

"AMD hasn't settled on the low-k material it will be use, but
barium-strontium-titanate (BST) and paraline compounds are candidates."

I guess he meant Motorola haven't settled on the low-k material!
Still, the interview was about 5 months ago, so things have probably moved on since then. When I read that line, plus "We don't foresee any major problems ramping up with the industry's most advanced process technology," plus "AMD has started qualifying the tool set at the fab here and "we haven't encountered any trouble yet,"" more than one seed of doubt was sown in my mind.

At the time I also reckoned that it sounded like a process development that was a year away from production - so that meant Cu/low-e in November 1999.

2 other points:

(i) It will be a nice clean SMIF'd fab - expect low defect density due to random particles
(ii) They expect to shrink to 0.15um this year using KrF/PSM lithography. Pretty aggressive but they hardly expect to ship product, do they? (keep your mouth shut Jerry)