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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: Rosemary who wrote (19282)	4/26/1999 9:15:00 AM
From: Roads End	Read Replies (1) \| Respond to of 93625

Rosemary....Why do we see so much hype when it comes to DDR? It is as if it is being threatened. Steve

To: Rosemary who wrote (19282)	4/26/1999 9:26:00 AM
From: REH	Respond to of 93625

Rambus Selects Snaketech for Substrate Modeling and Analysis of High-speed Devices BusinessWire, Monday, April 26, 1999 at 09:01 SAN JOSE, Calif.--(BUSINESS WIRE)--April 26, 1999--Snaketech, the emerging technology leader in integrated circuit (IC) design tools for RF, analog and mixed-signal designs, and Rambus Inc. (NASDAQ:RMBS), a leading supplier of high-speed interface technology for semiconductor memory devices, today announced the integration of Snaketech's substrate modeling and noise analysis solutions into the Rambus(R) circuit design flow. The integration of Snaketech's Layin(tm) suite of tools will enable Rambus designers to model substrate effects in the RDRAM(R) interface and ensure that product specifications are being met before manufacturing the semiconductor device. By incorporating Layin into the design flow, Rambus designers can now model and simulate the three-dimensional input structure to determine whether the tight specifications for input resistance are being met. It is these tight specifications that allow the RDRAM interface to operate at lower power and faster speeds. Layin enables significant costs savings because it eliminates pre-production design, fabrication and measurement iterations. Frank Fox, vice president and general manager for the Memory and Architecture Technology Division, Rambus Inc., said, "It is essential that we remain at the cutting edge of technology so we can provide our partners with the world's fastest DRAM interface. The high operating frequency of an RDRAM necessitates that substrate effects be taken into account. As I/O interface speeds become more and more critical, Snaketech's substrate noise modeling solution will help ensure that we meet customer demand for faster products." Tallis Blalack, chief scientist and vice president of U.S. operations for Snaketech noted, "Designers who cannot predict how the substrate will affect circuit performance are at a distinct disadvantage in today's competitive environment. Meeting time to market goals is critical. Rambus' own precise product specifications, combined with the complex fabrication processes of its world-class partners, required a flexible pre-production analysis capability like that found in our Layin tool suite. We were pleased that our tools fit Rambus' requirements and were easily integrated into the company's design flow." Rambus Inc. (NASDAQ:RMBS), based in Mountain View, Calif., develops and licenses high-speed chip-to-chip interface technology that enables semiconductor memory devices to keep pace with faster generations of processors and controllers. Providers of Rambus-based integrated circuits include the world's leading DRAM, ASIC and PC controller manufacturers. Currently, eight of the world's top 10 semiconductor companies license Rambus technology. More information on the company and its high-bandwidth interface technology is available at www.rambus.com. Rambus Inc., 2465 Latham Street, Mountain View, CA 94040, telephone 650/944-8000. Snaketech was incorporated in 1996 in Voiron, France. The company's mission is to develop high-value-added integrated circuit (IC) design tools for RF, analog, and mixed-signal integrated circuits. Snaketech's Layin(tm) suite of tools provides advanced substrate modeling and noise analysis solutions to IC designers. The company's investors include Sudinnova, Technocom, and R.A.C. For more information, visit the company's website at www.snaketech.com. Snaketech is located at 650 Saratoga Avenue, San Jose, Calif., 95129, tel. 408/557-6838, fax 408/557-6882. reh

To: Rosemary who wrote (19282)	4/26/1999 9:53:00 AM
From: Dave B	Read Replies (2) \| Respond to of 93625

Rosemary, I think you and Bilow might be talking apples and oranges. Bilow is talking about using DDR in low-volume, lower-speed, custom-designed solutions primarily, while you're talking about the high-volume PC business. I think you're both right, especially if, for all those engineers who already understand how to design with SDRAM, DDR isn't that big a change (which it doesn't sound like it is). Both will co-exist, but I would agree with your underlying sense that RDRAM will be the dominant player by far (95+% of new designs by volume). Don't forget that you can still buy almost every form of memory that has ever been developed to date, so even the market share of SDRAM is not 100%. Dave