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Politics : RAMTRONIAN's Cache Inn -- Ignore unavailable to you. Want to Upgrade?

To: Technored who wrote (7072)	4/27/1999 5:57:00 PM
From: Peace	Read Replies (1) \| Respond to of 14464

Ramtron Reports First Quarter 1999 Results biz.yahoo.com

To: Technored who wrote (7072)	4/29/1999 11:32:00 AM
From: Gutterball	Read Replies (1) \| Respond to of 14464

Ramtron and ULVAC to Jointly Develop Optimized Ferroelectric MOCVD Deposition and Etching Technologies Development to Establish Optimized Ferroelectric Processing Equipment for Advanced FRAM Product Manufacturing COLORADO SPRINGS, Colo.--(BUSINESS WIRE)--April 26, 1999-- Semiconductor manufacturer Ramtron International Corporation (Nasdaq: RMTR - news) and semiconductor production equipment manufacturer ULVAC Japan, Ltd., announced today that the companies have signed a three-year agreement to develop advanced plasma etching and metal organic chemical vapor deposition (MOCVD) equipment and process technologies for ferroelectric random access memory (FRAM®) products. The agreement provides the capital equipment and personnel resources necessary to cooperatively develop ferroelectric memory manufacturing equipment to be offered by ULVAC. The development efforts are expected to enhance the ability for Ramtron and its partners to more rapidly develop and commercialize future FRAM memory products. FRAM memory is a revolutionary memory technology developed and patented by Ramtron that merges the benefits of many memory technologies into a single device. FRAM memory possesses the high-performance attributes of mainstream memory technologies and has the ability to save its data when power is lost or removed. Ramtron and ULVAC have been working together since 1997, when the companies entered into a multi-phase FRAM technology development program utilizing ULVAC processing equipment. Under the terms of the expanded agreement, ULVAC and Ramtron will begin the installation of additional ULVAC processing equipment at Ramtron's Colorado Springs R&D facility during the fourth quarter of 1999. In addition, ULVAC will station additional technical personnel at Ramtron for the duration of the program. As progress is made during the program, Ramtron's facility will become the primary demonstration site for ULVAC's ferroelectric processing equipment. ''ULVAC is committed to being the leading supplier of a comprehensive line of process tools for ferroelectric integration technology and production,'' said Kyuzo Nakamura, ULVAC president and CEO. ''The recent expansion of Ramtron's research and development capability makes their Colorado Springs facility the ideal site for developing and demonstrating ULVAC's leadership.'' ''We are pleased that ULVAC has chosen to expand the scope of our joint ferroelectric technology development program,'' said Greg Jones, Ramtron president and COO. ''This agreement enhances our position as the leader in advanced FRAM research and development.'' In addition to its development work with ULVAC, Ramtron has FRAM licensing and manufacturing agreements with top semiconductor producers, including Fujitsu, Hitachi, Toshiba, and Rohm. The agreements provide for royalty considerations and manufacturing capacity that can be utilized by Ramtron to develop its own product business. The company also has FRAM licensing and/or development agreements with Samsung and Asahi Chemical. ULVAC Japan, Ltd., is a leading global supplier of production systems, instrumentation, vacuum pumps, and components for semiconductor, flat panel display, disk/magnetic media, and industrial vacuum and medical applications. The company's Web site is www.ulvac.co.jp Ramtron is the leading developer of ferroelectric random access memory (FRAM®) products. The company also develops and markets ultra high-performance EDRAM memory products through its wholly owned subsidiary, Enhanced Memory Systems, Inc. Ramtron holds 148 international and U.S. patents covering its proprietary technologies. For more information about Ramtron and its products, contact: Communications Department, Ramtron International Corporation, 1850 Ramtron Drive, Colorado Springs, Colorado, USA, 80921. Telephone is 800-545-FRAM (3726); FAX is 719-481-9294; E-mail address is info@ramtron.com. Homepage is www.ramtron.com and www.edram.com. Note to Editors: ''FRAM'' is a registered trademark of Ramtron International Corporation. -------------------------------------------------------------------------------- Contact: Ramtron International Corporation Lee A. Brown, 719/481-7213

To: Technored who wrote (7072)	4/29/1999 11:22:00 PM
From: Gutterball	Read Replies (2) \| Respond to of 14464

I talked to Lee briefly this morning. I was surprised he picked the phone up on the first ring -- must not have been getting a lot of calls lately. Anyway, I had a few questions on my mind. After reading this article on Intel inching away from Rambus, I was wondering if things were not beginning to opening up for Ramtron. After talking with Lee, I still have no clear indication. thestreet.com I was also wondering where this HSDRAM came from since there hasn't been much said. Little things like who was making it. After all, we hadn't gotten any PR on HSDRAM like we had on ESDRAM and IBM and Siemens. Lee indicated that that partner was not public information and we left it at that. I'm pretty sure IBM is not making HSDRAM. On another note, some of the equipment from the Fujitsu deal has arrived at Ramtron. One concern Lee had was getting RMTR's price above a buck. The board feels the reverse split was the best avenue. One advantage Lee stated was that 60 million shrs were too many for a small company like Ramtron to keep track. The proxy on the reverse split was held back until the 10K was out. This was something the SEC wanted. Shareholders should be getting the proxy on the reverse split soon and the reverse split issue will be resolved in about a month. Me I'm out and don't care how shareholders vote on the proxy. One thing we agreed on was that Ramtron was under a dark cloud until the preferred holders were out of the picture. That's about it.