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To: Steve Fancy who wrote (2216)	4/28/1999 7:15:00 PM
From: SemiBull	Respond to of 3813

Copper-plating marathon test proves high throughput and uniformity, says Semitool KALISPELL, Mont. -- Semitool Inc. today announced it has successfully completed a marathon performance test of its LT-210c high-volume manufacturing tool for copper interconnect plating. In a competitive environment, the LT-210c processed more than 5,000 wafers, and its performance confirmed the company's expectations in throughput and uniformity. "The LT-210c demonstrated throughput capability of 70-plus wafers-per-hour while maintaining less than 2% non-uniformity on 0.8-micron film," said CEO Fabio Gualandris. "To date, we have 32 copper electrochemical deposition [ECD] systems installed at 20 customer sites throughout the world, which we estimate have plated more than 1 million wafers." The achievement of low non-uniformity on thin plated film is significant, said Thomas Taylor, general manager of Semitool's ECD Division. "Low non-uniformity is necessary for success in the subsequent CMP [chemical mechanical planarization] process. Because it is easier to achieve lower non-uniformity with thick film, members of our industry often relate non-uniformity levels to thicker films of 1.3 to 1.5 micron. "Semitool is achieving these typically referenced non-uniformity levels with substantially thinner films," he added. "With highly uniform thin film, fabs will see higher throughput from both their CMP and plating equipment." For tested wafers, average within-wafer non-uniformity was less than 1.5%, and wafer-to-wafer variation was less than 1%, Taylor said. The LT-210c system used for the marathon test is a production system similar to one Semitool recently delivered to a major chip maker in Europe. The system includes real-time closed-loop bath analysis and replenishment for precise maintenance of organic additives as well as inorganic constituents, and automated chemical delivery and recovery. Processes are available for uniform fill of features as fine as 0.15 micron (0.11-micron design rules) with 10:1 aspect ratios. "These capabilities are the result of our two-year partnership with chemical manufacturers to develop an optimum combination of electroplating chemistry and tool design," Gualandris added. The LT-210c system also includes the supervisory workstation for automated machine management and statistical process control supplied by SEMY Engineering, Inc., a wholly owned subsidiary of Semitool. A 300-mm platform is being prepared for introduction later this year, Gualandris said. "Our chambers and processes have been designed for easy leverage to 300-mm. We have successfully plated 300-mm wafers for customers with excellent results. When our customers are ready for 300-mm, we will be ready,".

To: Steve Fancy who wrote (2216)	4/28/1999 10:07:00 PM
From: G. H.	Read Replies (1) \| Respond to of 3813

Good evening Steve, and thread. IMO, this is just a normal pull back, some flushing out. I have traded NVLS in the past and today I took a new position, I do not think that it will retrace back to the low 40's, but upper 40's would not be unreasonable. I believe the market will trade sideways for the next month, until AMAT post's up their numbers, I believe May 18 or so. By that time frame, if AMAT can deliever, then I think the market will become true believers in this current upturn. Take care Henry