Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Jack Kunkle who wrote (29790)	4/29/1999 11:06:00 AM
From: Tony Viola	Respond to of 70976

Jack, thanks for the Register article. The copper technology is included in the .13 micron P860 process, and Intel already has test structures and test chips functioning with copper interconnects and .13 micron lithography, the source claimed. Re copper getting introduced into Intel chips, the article implies it's real early. It may seem so calendar-wise, but technology-wise, it has always been planned by Intel for 0.13 micron, never 0.18. Maybe the YUK register (as it's called on the Intel and AMD threads) doesn't know about pilot stuff preceding production by a good amount of time. Good to see Intel validating Copper interconnect for chips, along with IBM and MOT. The big deal chip for copper at Intel is, I believe, McKinley, which is the second of their IA-64 family of 64 bit chips after Merced. Maybe Merced cuts it in also, not sure. Merced production is next year, McKinley 2001, if schedules hold. Tony