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Technology Stocks : Kopin Corp. (KOPN) -- Ignore unavailable to you. Want to Upgrade?

To: kinkblot who wrote (672)	5/6/1999 3:52:00 PM
From: John Finley	Read Replies (1) \| Respond to of 1820

So that's how they do it! SOITEC anyway. I'd never heard of hydrogen delamination induced splitting. Of course that means you have to have an ion implanter handy but that's not a problem for today's foundries. I'd bet KOPN uses something similar as long as the ~600C anneal isn't prohibitive once the circuit is in place. SOITEC claims they can do it on 200mm (300mm?) wafers and get <5% thickness uniformity. This is neat technology! Thanks yet again, Will. You are a wealth of great information. JF