Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Kevin K. Spurway who wrote (57622)	5/7/1999 5:27:00 PM
From: Process Boy	Read Replies (1) \| Respond to of 1572178

Kevin - " Fab 30 is using some type of pod technology for this" Without seeing the article, I can't comment directly on it. But my concept "pod technology" would not be new. It is possible that F30 is using some novel, or more precisely, different, layout scheme, than what I am acustomed to, or different than F25 for that matter. If you find the article, strike up this topic again. I will look into it also, and see what I can dig up. However, I am still under the impression that F25 will convert to Cu at some point, and there must be a method short of shutting the place down to do this. My bottom line is the .18um Cu process will not be ready for AMD "in time", therefore they need to develop a .18 Al process in addition to the Cu process. I believe even Intel would consider the cost of such a venture prohibitive. PB

To: Kevin K. Spurway who wrote (57622)	5/7/1999 6:26:00 PM
From: Paul Engel	Read Replies (2) \| Respond to of 1572178

Kevin - Re: "Fab 30 is using some type of pod technology for this" Are you referring to SMIF containment ? If so, AMD will be using SMIF containment in FAB 30. This is a Standard Modular Interface Format - for wafer containment and load/unload into process equipment. It is NOT specific for Copper processing - it merely keeps wafers in an environmentally sealed box during storage and transfer and the SMIF box interfaces to the various tool sets so that the wafers are not exposed to "atmospheric conditions" during transfer in and out of process equipment. True to form, Fab 25 is NOT a SMIF fab - so ALL THE equipment I/O and wafer handling will be different between the two fabs. COPY DIFFERENTLY - AMD's motto. We all know what we can expect. Paul