Monday May 10, 8:30 am Eastern Time
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Company Press Release
SOURCE: LSI Logic Corporation
LSI Logic Now Offers 66-MHz FlexCore PCI Architecture In G11 (.25-Micron) Process
With Three Interface Options and Pre-Verified Timing, the PCI FlexCore Architecture Enhances LSI Logic's Leadership in High Speed I/O
MILPITAS, Calif., May 10 /PRNewswire/ -- LSI Logic (NYSE: LSI - news), The System on a Chip Company®, announced today that it is now offering its 66-MHz FlexCore® peripheral components interconnect (PCI) architecture in G11(TM) (0.25-micron) process technology. The PCI-66 core, initially introduced in March 1997 in the G10® (0.35-micron) process technology, is the industry's first 66-MHz modular hard macro implementation of the PCI interface. This core is capable of supporting bus speeds of up to 66-MHz with bus widths of either 64- or 32-bits. This core enables designers to develop high performance systems on a chip providing up to 528-Mbytes/second of peak bandwidth.
The PCI-66 core is part of LSI Logic's extensive CoreWare® library for system-on-a-chip designs. It is developed for integration into an ASIC and provides complete interface solutions for the PCI bus, enabling the development of highly integrated PCI adapter cards and host-bridge ASICs. The PCI-66 core can be used with LSI Logic's other leading-edge I/O products such as the Rambus D-RAC core, the GigaBlaze® core, and the HyperPHY(TM) core for a high-performance, system on a chip solution.
''We decided to use the PCI-66 FlexCore architecture because it accelerates our time to market, it is easily integrated, completely verified, and fully supported,'' said Ottawa, Ontario-based Bill Swift, director of engineering for Cisco's Optical Internetworking Business Unit. ''LSI Logic is a recognized leader in high-speed I/O with a strong track record in core integration. They were the obvious choice for providing the PCI core.''
As a hard macro, with a fixed layout, the PCI-66 core has precise clocking and pre-verified timing for operation up to 66 MHz in 32- or 64-bit modes. This solution lets the ASIC designer focus on value-added logic and ASIC integration rather than solving the timing challenges of the PCI interface. Soft macro PCI cores, on the other hand, can require a significant effort to reach timing closure. In addition, the PCI-66 FlexCore architecture has been extensively tested with over 40 million cumulative simulation cycles. The architecture has also been proven in both test chip silicon and used in production ASICs.
The modular FlexCore architecture provides the flexibility required for easy use by offering three interface options: (1) slave interface for PCI target applications, (2) master/slave interface supporting PCI host applications, and (3) master/slave/FIFO interface for full functionality with an asynchronous FIFO interface. These three interface options result in a flexible solution that lets the ASIC designer select the optimal configuration based on performance and cost requirements.
''Bandwidth demands on the PCI bus have increased from a number of areas, including performance-intensive embedded applications such as multi-function peripherals, storage subsystems and communications subsystems. Coupled with the need for higher densities, higher performance, and lower power, the PCI-66 in the G11 process is an ideal solution for many of today's high-speed I/O applications,'' said Rich Hovey, product line manager, Computer Products Division, LSI Logic.
The LSI Logic CoreWare methodology program provides a full range of complex building blocks, proven design methodology, leading edge technology and applications support necessary to build a complete system on a chip uniquely optimized for the target application. The CoreWare library includes a full range of RISC® microprocessors, Rambusa D-RAC, Fibre Channel, GigaBlaze, ATM, USB, Ethernet-10, and PHY-110 cores.
About LSI Logic
LSI Logic, The System on a Chip Company®, is a leading supplier of custom high-performance semiconductors, with operations worldwide. The company enables customers to build complete systems on a single chip with its CoreWarea design program, which increases performance, lowers system costs and accelerates time to market. LSI Logic develops application-optimized products in partnership with trendsetting customers, and operates leading-edge manufacturing facilities to produce submicron geometry chips. The company maintains a high level of quality as demonstrated by its ISO 9000 certifications. LSI Logic Corporation is headquartered at 1551 McCarthy Boulevard, Milpitas, California 95035, lsilogic.com.
NOTE: The LSI Logic logo design, GigaBlaze, FlexCore, G10, The System on a Chip Company and CoreWare are registered trademarks and G11, and HyperPHY are trademarks of LSI Logic Corporation. All other brand or product names may be trademarks or registered trademarks of their respective companies.
SOURCE: LSI Logic Corporation
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