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To: Kirk © who wrote (2862)5/11/1999 4:30:00 PM
From: Duker  Read Replies (1) | Respond to of 5867
 
The technology marches on ...

Virtual Silicon says 0.18-micron test chip successful on TSMC process

A service of Semiconductor Business News, CMP Media Inc.
Story posted 2:30 p.m. EST/11:30 p.m., PST, 5/11/99

SUNNYVALE, Calif.--Virtual Silicon Technology Inc. here today said a 0.18-micron test chip has demonstrated that its design libraries are manufacturable on a new six-level metal process being prepared by Taiwan Semiconductor Manufacturing Co. (TSMC) for silicon foundry services.

The Sunnyvale-based company said the test chip validates that its TSMC-specific libraries are reliable and offer specified performance from the 0.18-micron technology.

"The quality of Virtual Silicon's process performance correlation and reliability test chips is excellent," declared Ping Yang, vice president of Design Services Department Engineering at TSMC. The Taiwan foundry giant is expected to soon launch its 0.18-micron processes for wafer processing services later this year. A variety of options are planned, including copper interconnect.

Evaluation kits for Virtual Silicon's 0.18-micron libraries are now available. Standard cell and memory compilers for TSMC 0.18-micron will be available by June. Virtual Silicon said it would make available a report on the performance of the 0.18-micron test chip to TSMC customers under a non-disclosure agreement its existing facility.