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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?


To: Process Boy who wrote (80825)5/13/1999 7:22:00 PM
From: Tony Viola  Read Replies (1) | Respond to of 186894
 
PB,

Thread, before this gets out of hand, Intel has assembly operations in the
Phillipines, no fab.


About the Intel Phillipines ASM plant discussion, some posts below about it that followed when it got over to the AMAT thread. The other guy besides me appears to work for Applied and it sounds like he's saying (his words) that they, Intel "don't seem to be betting on a flat near term future."

Message 9518005

Good indication of Intel's momentum, though.

techstocks.com



Mark, could you elaborate on "Intel's momentum", without
divulging any non-disclusure agreement stuff?

Thanks,

Tony


techstocks.com

Tony <<...elaborate on Intel's momentum...>> No NDA info
needed. Just that "chipzilla" (the only decent thing I've read from
UK rag) is still investing strongly. Question: when was the last
time Intel had too much capacity? Seems like they've been betting
on the future better than anyone else, so when they're gearing up,
they don't seem to be betting on a flat near term future...



To: Process Boy who wrote (80825)5/13/1999 11:23:00 PM
From: Paul Engel  Respond to of 186894
 
Process Boy - Re: " This article is so full fo sh*t I can smell it from here (Oregon)."

You called that one right !

Clearly, the YUK Wretchister is just a rumor mongeror - they NEVER bothered to check ONE LITTLE DETAIL.

Re: "Intel has a fab in the Philippines but if the government minister is right, it probably means that there will be a refurb of its facilities to .18 micron technology. "

ABsolute 1000% BULL SH*T !

Intel has an assembly plant in Makati (Manila) and a fairlly new assembly facility in Cavite - south of Manila.

Assembly, for the benefit of the YUK Wretchister , is the collection of operations that takes COMPLETED wafers, separates the individual good die, and places them in physical "packages" where they are electrically connected to the external leads (or terminals) on the package via wire bonding or C4 flip chip bonding.

Paul