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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Paul Engel who wrote (58370)	5/17/1999 1:20:00 AM
From: Mani1	Read Replies (1) \| Respond to of 1574680

Paul Re <<The additional heat dissipation will be a PROBLEM >> NO! At about 60W the biggest "bottle-neck" for thermal management is the resistance due to the "interface" between the dye and the heat spreader/slug. Even the best greases or thermal pads between the die and perfectly polished surface will not exceed 15,000 (W/m^2.K). At the large die size of the K7 that resistance is not much higher than the K62. However if the K7 had a die size of, lets say, 80 mm^2, the thermal management would be a very serious issue. My estimate of $3.00 which is on the high side, is for a slightly bigger fan and sink. Mani