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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Yousef who wrote (59473)	5/24/1999 2:47:00 PM
From: Kevin K. Spurway	Read Replies (1) \| Respond to of 1573922

Re: "Sounds like IBM is taking a "surer" approach to Cu/Low K ... I wonder why Motorolo is taking the "risky" path. Could it be that Motorolo is behind ??" Were we reading the same article? Sounds to me like Motorola is ahead of the curve: "The researchers' results were particularly surprising in view of the audacity of the attempt. Most companies have chosen to follow a step-by-step road map to the necessary combination of copper and low-k dielectrics, said Bijan Davari, vice president of the semiconductor research and development center at IBM Microelectronics."... "Motorola's results are particularly exciting because they appear to leapfrog past methodical sequences of materials, going directly to techniques that are far down the road map. Additionally, the Motorola team has reported not just the bulk properties of a porous film, but successful fabrication of complex copper structures with a porous film, using conventional CMP techniques. Previously reported work has focused mainly on materials used with the much less invasive aluminum, in single-level structures." Could it be that the word LEAPFROG is used for a reason? It was used TWICE in the article. Re: "I think that Yousef warned about Low K/Cu integration issues." Referring to yourself in the third person? Or did you mean to post this under a different identity and mess up? Kevin