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To: Don Green who wrote (20822)	5/26/1999 5:32:00 AM
From: Shumway	Respond to of 93625

News ! Connector cos. ready for RDRAM May 26, 1999 ELECTRONIC BUYERS NEWS via NewsEdge Corporation : Despite the delay in Intel Corp.'s launch of its 820 chipset and lingering uncertainty about the time frame for the industry's adoption of the Direct Rambus DRAM interface, the world's three leading connector makers are preparing for a strong surge in demand for parts compliant with the Rambus memory systems. AMP Inc., FCI Electronics Worldwide, and Molex Inc. have each been developing connectors for Rambus in-line memory modules (RIMMs) for more than a year, and none of the three has backed off of its efforts on that front as a result of Intel's scheduling shift. In March, Intel pushed back the high-volume delivery date for the Intel 820, or "Camino," chipset until late in the third quarter. The chipset, which features the 800-MHz Direct RDRAM interface, was a key component in many PC OEMs' planned transition to the new memory. It had been expected to be widely available in June. And while the delay has spurred some Direct RDRAM chip makers and OEMs to re-evaluate their product plans, raising questions about how quickly the industry will adopt the new design, connector suppliers stand ready to deliver large volumes of parts that support the Direct RDRAM architecture. AMP, Harrisburg, Pa., earlier this month said its connectors for RIMMs have passed Rambus' validation testing and meet the impedance requirements that allow for transmission of data on the high-speed Rambus system. But while AMP can lay claim to bragging rights for being the first connector supplier deemed fully compliant with the Rambus specifications, its competitors are likely to follow soon. "AMP is first in being fully compliant and validated, but I think the others are close behind," said Subodh Toprani, vice president and general manager of Rambus' Industry Enabling Division. Toprani said he expects to see Molex and FCI Electronics, as well as some of the other connector makers that have been tooling up for the Direct RDRAM model, to be in full compliance with the Rambus specifications within the next three months. "I believe that the connector industry is more than poised to deliver as many connectors as the OEMs want this year and next year," he said. AMP is already geared up for high-volume production of RIMM connectors. "We have capacity now for about 800,000 per month, and we have plans in motion to get to 1.5 million per month by the September time frame," said Jim Leidy, marketing manager for AMP's global PC division. Although he acknowledged that AMP did re-evaluate its RIMM-connector program when Intel changed the Camino chipset time-frame, Leidy said the company did not retreat from its plans to supply the parts in mass quantities. AMP is already seeing strong demand from the top five U.S. PC manufacturers, he said. "We didn't slow things down, we just delayed the capital expenditures for additional capacity," Leidy said. "In June we'll decide whether we'll pull the plug for more capacity. One-and-a-half-million a month should be sufficient to cover us through the early ramp-up, but we're going to have to start in June if we're going to make the massive volumes they're talking about by the end of the year." Meanwhile, AMP's major U.S.-based rival, Molex, also stands ready to support Direct RDRAM. "We've ramped up into high-volume production as well," said Kevin Alberts, product manager for RIMM connectors at Molex, Lisle, Ill. Although he declined to provide specific capacity figures, Alberts said Molex continued full force with its RIMM-connector program in the wake of Intel's shift in timing. "We set forth a production plan several months ago, before the push-out, and we've followed through with that," he said. "We've continued with our tooling and production plans, and we're set for high volume right now. I would expect, as Rambus and Intel have been stating, that with the release of the 820 chipset, the demand will ramp very quickly." Executives at FCI Electronics-which, with the acquisition of Berg Electronics Corp. by Paris-based parent Framatome Connectors International, became a RIMM-connector supplier last fall-are likewise optimistic about demand for the products. "We are not focusing so much on the 'if' but more so on the 'when,'" said Michel Cuilhe, president and general manager of the Valley Green, Pa., company. "We are ramping up in production right now." Copyright c 1999 CMP Media Inc. By Richard Richtmyer <<ELECTRONIC BUYERS NEWS -- 05-24-99, p. PG38>> [Copyright 1999, CMP Publications]

To: Don Green who wrote (20822)	5/26/1999 5:35:00 AM
From: Shumway	Respond to of 93625

More News! New SABER Technology Center Opens in Silicon Valley; Targets Faster Time-to-Market for Regional Semiconductor Manufacturers and Fabless Industry May 26, 1999 SAN JOSE, Calif.--(BUSINESS WIRE) via NewsEdge Corporation -- New Facility Focuses on Rambus(R) Characterization and Fabless Supply Chain Services; Provides Access to SABER Skilled Resources and Leading-Edge Equipment Schlumberger today opened the Schlumberger Advanced Business Engineering Resources (SABER(SM)) Technology Center in Silicon Valley. This new technology center will focus on Rambus(R) characterization and fabless supply chain services to enable regional customers to achieve faster time-to-market for RDRAM(TM), ASIC and system-on-chip (SOC) devices. The Silicon Valley site, which is located in San Jose, is the second of eight worldwide SABER Technology Centers that Schlumberger is opening this year to meet the highly targeted needs of regional customers. The new facility is staffed with a team of highly skilled technical, operational and business professionals with expertise in design verification, device characterization, test cell integration, failure analysis, design debug, thermal characterization and other key processes. The site supports the integration of a working environment to enable SABER experts and their clients to develop best practices and new test solutions that help local semiconductor manufacturers solve their key test challenges and achieve improved productivity. "The SABER Technology Center in Silicon Valley provides the highest level of technical expertise, best-in-class skill sets and a state-of-the-art environment for addressing the specific requirements of Silicon Valley-based customers," stated Jean-Luc Pelissier, SABER vice president and general manager. "Fabless customers and traditional manufacturers alike must address the unique test challenges posed by today's rapidly evolving technologies, especially the new RDRAM and SOC devices. They can now significantly benefit from outsourcing to SABER the special test capabilities that are not part of their core expertise." Technology-Leading Equipment from Schlumberger The Silicon Valley SABER Technology Center will house leading-edge Schlumberger diagnostic and test equipment, including: -- RDX2200(TM) - the industry's only RDRAM test system that meets Rambus specifications for speed and accuracy across multiple sites. Providing the industry's highest level of accuracy and performance, the RDX22000 series is designed to significantly shrink memory manufacturers' time-to-volume, slash months off development cycles and dramatically increase yields. -- EXA2000 - the industry's most comprehensive, high performance SOC test solution. The EXA2000 provides a complete high-throughput test solution for today's complex SOC devices, such as HDTV, DVD, ISDN and PC chipsets. -- ETC 1000 - breakthrough precision in semiconductor device thermal control. The only system capable of handling power densities above 10 Watts/cm2, the ETC 1000 delivers unparalleled performance for die and transistor junction temperature control, especially for high power devices, such as microprocessors and SOC devices. -- ITS 9000IX - the industry's first 400MHz logic test system. The ITS 9000IX is today's standard for testing CISC microprocessors, new RISC designs and other high-end logic devices. -- IDS 10000plus - the latest generation of electron beam probing systems. The IDS 10000plus is designed specifically to meet the requirements of leading-edge devices by providing image resolution to probe 0.18-0.35um design rules. -- AMS 3000 - the premier tool for IC debug and repair of advanced analog and SOC devices. The AMS 3000 is the only system to allow probe point creation for multiple layer processes and analog waveform measurement within one single system. -- IDS P2Xplus - probe point creation for buried layer probing by the IDS 10000plus, using advanced FIB technology and gas chemistry. The only FIB system designed to be fully hardware and software compatible with the IDS 10000plus, the IDS P2Xplus reduce probe point creation and waveform acquisition turnaround time by 75 percent. SABER Expertise Speeds Customers Towards Profitability SABER was launched in 1998 to provide the full range of innovative technical and business management services to the semiconductor industry. Dedicated to significantly improving customers' time-to-market, time-to-volume and profitability, SABER is a performance-based "general contractor" across the entire silicon cycle, helping companies maximize existing equipment and processes. SABER leverages more than 60 years of Schlumberger expertise as an outsourcing partner, along with the company's global infrastructure, technology leadership, industry knowledge, and extensive experience in high-volume manufacturing to provide customers with integrated, end-to-end solutions. Since SABER began offering comprehensive operational and business management services to the semiconductor industry last year, it has already established a successful track record helping customers gain up to 35 percent improvement in productivity. Reflecting the growing demand for its services, SABER will open eight regional Technology Centers in 1999. In addition to the first two sites announced in San Jose and Fuchinobe, Japan, six additional sites are being opened in Taiwan, Singapore, Korea, France (two sites) and the U.K. this year. About Schlumberger Schlumberger ATE designs and manufactures the most comprehensive line of manufacturing equipment for testing of semiconductors devices, including diagnostic systems, automation systems and automatic test equipment. It also provides measurement systems for front-end applications, as well as equipment to test complete electronic assemblies and systems for the telecommunications and automotive industries. A worldwide industry leader, ATE maintains the largest internationally installed base of automatic test equipment systems. Additional information is available on the World Wide Web at slb.com. Schlumberger Test & Transactions is comprised of Schlumberger ATE and Schlumberger Smart Cards & Terminals, leveraging the combined strengths of the business units to provide leading-edge, cost effective solutions to customers. Schlumberger Test & Transactions is a business unit of Schlumberger Limited, a $11.8 billion global technology service company providing oilfield services, natural resources management, transactions-based technology and associated systems, and semiconductor test equipment. Note to Editors: RDX2200 and SABER are marks of Schlumberger. Rambus and DRDRAM are registered trademarks of Rambus, Inc. <<Business Wire, 05-25-99, 16:04 Eastern>> CONTACT: Schlumberger \| Michele Bernhardt, 408/501-7145 \| michele@san-jose.tt.slb.com [Copyright 1999, Business Wire] Quick Search Company Lookup Company Name or Ticker

To: Don Green who wrote (20822)	5/26/1999 5:37:00 AM
From: Shumway	Read Replies (1) \| Respond to of 93625

Withdrawn Intel suit a mystery May 26, 1999 ELECTRONIC BUYERS NEWS via NewsEdge Corporation : Two weeks after Intel Corp. withdrew its lawsuit against Taiwanese chipset maker Via Technologies Inc., executives were still bitter about the action taken by the chip maker. "I believe Intel is really worried, and the lawsuit was meant to intimidate us and perhaps OEM customers," said Dean Hays, Via's vice president of marketing, at the company's Fremont, Calif., location last week. "It was totally off base, because our Intel license definitely covers any Via chipset that might be of concern to Intel." Intel had filed a breach-of-contract suit against Via, charging the Taipei-based company with trying to sell an unlicensed logic chipset, according to court documents filed in San Jose. On the same day the lawsuit was filed, Intel withdrew it, claiming it was was mistakenly filed by its outside counsel. Intel's perplexing action came just after it had settled an antitrust case with the Federal Trade Commission over earlier licensing disputes with Compaq Computer Corp., the former Digital Equipment Corp., and Intergraph Corp. Some industry observers wondered if Intel's admitted "mistake" in filing the Via lawsuit involved second thoughts on how this action might affect the just-concluded FTC settlement. A spokesman for Intel, Santa Clara, Calif., said there is no relationship between its licensing dispute with Via and the settlement with the FTC. A copy of the withdrawn Via suit revealed that Intel wanted a restraining order against Via selling unspecified chipsets using Intel technology that allegedly had not been licensed to the Taiwanese company. Hays claimed that all of Via's current and upcoming chipsets that connect to Intel's Celeron and Pentium processors are covered by the licensing agreement. Furthermore, he said Via's upcoming integrated chipset that uses Trident Microsystems' graphics-accelerator core and competes head on with Intel's integrated chipset, which also implements Trident's technology, are protected under the contract as well. Hays speculated that Intel might be concerned with Via's imminent chipset designed to connect PC133 SDRAM with Intel processors, since Intel is doing all in its power to derail adoption of PC133 in favor of Direct Rambus DRAM. The Intel spokesman said Hays was misinformed about chipsets covered by the licensing agreement. He declined to elaborate, however, claiming the licensing agreement was confidential. The Intel complaint did not identify the specific Via chipsets in question, but the suit said Via "began in February and March, 1999, demonstrating the chipsets to OEMs and providing samples to OEMs for evaluation purposes, and informing OEMs that the chipsets would be available for delivery in the third quarter of 1999." Copyright c 1999 CMP Media Inc. By Jack Robertson <<ELECTRONIC BUYERS NEWS -- 05-24-99, p. PG82>> [Copyright 1999, CMP Publications]