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To: Ian@SI who wrote (22137)	5/30/1999 11:43:00 PM
From: Zeev Hed	Respond to of 25960

Ian, right now I would take the position that what Craig reported is no more than an "inventory foul up" between that company and AMAT. We'll see if the SOX holds recent support at about 360, if it does not we may have to find the fundamental reasons for that, maybe a small blip is unraveling in this upcycle. I still think that such unraveling is temporary, but I'll follow the charts to tell me what to do. Zeev

To: Ian@SI who wrote (22137)	6/1/1999 10:04:00 AM
From: BillyG	Read Replies (1) \| Respond to of 25960

Lam aims newest etcher at range of 0.13-micron logic, DRAM processes A service of Semiconductor Business News, CMP Media Inc. Story posted 7 a.m. EST/4 a.m., PST, 6/1/99 By J. Robert Lineback FREMONT, Calif. -- Lam Research Corp. here today rolled out its next-generation dielectric etch system for a range of process steps in memory and logic fabs producing devices with 0.18-micron and below drawn feature sizes. The Exelan uses Lam's dual-frequency diode technology with plasma confinement and a new reactor design that greatly enhances performance and tool productivity, according to the company. The 200-mm tool features a new dynamic wafer area pressure control system that places a sensor immediately above the wafer during etching. The tool also has a new RF subsystem design, which delivers 27- and 2-MHz frequencies through a single electrode positioned underneath the wafer. The result, according to Lam, is a tool capable of etching dielectric materials in all 0.13-micron logic process steps--including dual-damascene copper interconnects with low-k insulators--as well as nearly all memory etch applications. "The only process step that Exelan does not address is the high-aspect ratio contacts on memory devices, which we estimate to be about 10-15% of the [dielectric etch] market," said Greg Campbell, vice president and general manager of Lam's Etch Products Business Group. "That application is already addressed by our 9100." Based on results from hardware and process characterization tests, the Exelan is expected to have a cost-per-wafer rating that's about half to 60% of competing tools, according to Lam. Wafer throughput of the new etch system has been increased 15% over other systems running the same process recipe, said the company. The built-in sensor design improves the ability to control pressures during etch processes, Campbell said. "Other systems try to control pressure at the pump, by varying the pump speeds, but we have a sensor built right next to the wafer surface and two confinement rings on the system move up and down. The space between the rings controls the pressure," Campbell explained. In addition to delivering 27- and 2-MHz frequencies from a single electrode, Exelan's RF subsystem measures and feeds back control information on voltages and current. This setup is intended to improve accuracy and RF control. "By combining the two [frequencies] on the bottom electrode, and measuring right on the wafer, we have much more RF control," Campbell said. Lam has already begun shipping Exelan systems to customers and it plans to be able to aggressively increase production of the etch tool in the second half of 1999, depending upon market demand. To date, the Fremont company said it has processed over 30,000 wafers in-house and it's on track to do about 100,000 eight-inch wafers by October. Company officials declined to disclose pricing information on the Exelan system.