Interesting story link on EE News - Exclusive: IBM to drop Rambus on future PC plans. sumnet.com
I say it's interesting as the link leads to another story, but if this is true there could be trouble in Rambus town.
I've been watching this story and wondering when, or if, I should buy in as sometimes the market says Rambus will rule DRAM and at other times it looks like they will be too costly. Certainly, DRAM makers want a cheaper solution and they'll have it unless Intel can forces the move to RDRAM.
Found it. Message 9835271
Regards,
Mark
Toshiba to Launch World's Smallest 128- and 144-Megabit Rambus DRAM in 600MHz, 711MHz and 800MHz Speeds; Toshiba Achieves Industry's Smallest Chip Size Using 0.20 Micron Process
BusinessWire, Monday, May 10, 1999 at 11:12
IRVINE, Calif.--(BUSINESS WIRE)--May 10, 1999--Toshiba America Electronic Components Inc. (TAEC) Monday announced 128- and 144-megabit (Mb) Rambus(R) dynamic random access memory (RDRAM(R)), bringing the two largest commercially-available Rambus memory capacities to the smallest chips yet realized at this density.
Samples of these new memory devices have been shipped to Rambus Inc. for testing and will soon be shipped to customers in module form.
These advanced memory ICs are intended for use in high-performance computers using the Rambus main memory system, which provides peak data transfer rates of 1.6 gigabytes/second, or two to three times as fast as today's widely used 100 megahertz (MHz) Synchronous DRAM. Toshiba forecasts that by the year 2001, the RDRAM segment will grow to approximately a 50 percent share of the main memory market.
"As a result of our advanced 0.20 micron (um) process, Toshiba's 128/144Mb RDRAM die is the smallest on the market today, enabling us to achieve excellent production efficiencies," said Jamie Stitt, business development manager, Memory Business Unit at TAEC. "This high-performance process enables improved yields at the higher speeds and reduces power consumption."
With its new devices, Toshiba combines Rambus performance advantages with its leading-edge 0.2um lithography to create the industry's smallest 128Mb and 144Mb devices at only 103mm(2) and 114mm(2), respectively.
"Toshiba's achievement of small die sizes for its leading-edge 128Mb and 144Mb RDRAMs, coupled with its success in developing lower-cost CSP packaging offers significant reassurance to PC OEMs as they prepare for high volume PC shipments," said Subodh Toprani, vice president and general manager, Industry Enabling Division of Rambus Inc.
Toshiba was the first supplier with confirmed 800MHz, or 1.6 gigabyte per second (GB/s) functionality, at the 72Mb RDRAM generation, and is one of the first suppliers with these higher density versions, which provide twice the memory capacity. Both the 128Mb device, with a x16 configuration, and the 144Mb device, with x18 configuration, are available in 600MHz, 700MHz and 800MHz speeds to support PC600, PC700 and PC800 applications, respectively. The 144Mb, x18 memory ICs provide 128Mb of usable memory, plus extra bits to support error correction code (ECC).
"Toshiba is the first supplier to bring RDRAM to market using the 0.20um process, thus providing an excellent example of the benefits of our Scalable by Design(TM) program," said Stephen Marlow, vice president, Memory Business Unit for TAEC. "All of our high-performance 128Mb generation DRAM solutions use the same memory cell design and 0.20um process, which enables us to ramp capacity quickly to meet market demand. In addition, this enables us to manufacture these advanced memory solutions at any of Toshiba's global network of fab facilities."
The 128/144Mb RDRAM components are packaged in a Toshiba-developed 62-pin chip scale package (CSP) that uses the same production equipment as traditional TSOP packages. As a result, packaging costs are reduced and throughput is increased compared to RDRAM packaged in uBGA packaging. This CSP packaging also supports a "mirror package" that allows simpler design for modules with components on both sides.
Pricing and Availability
Samples of Toshiba's 128Mb and 144Mb RDRAM components are available now, priced at $85 and $100 each, respectively. See table below for part numbers and available configurations. Production quantities of these components and related RIMM(TM) and SO-RIMM(TM) modules will be available in third quarter 1999, and production pricing will be available at that time.
*T Toshiba 128Mb/144Mb RDRAM Components
Part Number Data Rate Configuration TC59RM716MB/RB-6 600MHz x16 TC59RM716MB/RB-7 711MHz x16 TC59RM716MB/RB-8 800MHz x16 TC59RM718MB/RB-6 600MHz x18 TC59RM718MB/RB-7 711MHz x18 TC59RM718MB/RB-8 800MHz x18 *T
About Scalable by Design
Scalable by Design represents Toshiba's commitment to future technologies and is supported by its modular design approach that enables easier and less expensive transition to the next process generation or memory density. To make the most efficient use of the company's wafer fabrication facilities, Toshiba's memory products have been designed for scalability.
By harnessing advances from the trench cell-based 256Mb DRAM development project and applying them to the 64Mb and 128Mb densities, Toshiba can seamlessly scale five generations from 0.35um to 0.15um with one clean room. The result is smooth and predictable transitions, simplified qualifications and rapid cycling of process and products. With necessary investments and major technological hurdles overcome at the 0.35um geometry, only an additional modest 10 percent investment is required for each successive microlithography refinement. Toshiba is carrying these same principles forward in its 256Mb DRAM production plans and across other products.
About Toshiba
Toshiba America Electronic Components (TAEC) is the North American engineering, manufacturing, marketing and sales arm of Toshiba Semiconductor Company and Display Devices and Components Company. TAEC is recognized as one of the world's largest suppliers of semiconductor, electronic component and storage solutions. Toshiba's Semiconductor Company is one of the world's leading manufacturers and suppliers of semiconductor products including LSIs, microprocessors and controllers, and advanced memory products, in addition to discrete and bipolar components. The company is also responsible for global sales and marketing of other major electronic components including liquid crystal displays, color display and picture tubes, lithium-ion and other secondary batteries. For additional information, visit TAEC's Web site at, toshiba.com.
Rambus Inc. (NASDAQ:RMBS), based in Mountain View, Calif., develops and licenses high-speed chip-to-chip interface technology that enables semiconductor memory devices to keep pace with faster generations of processors and controllers. Providers of Rambus-based integrated circuits include the world's leading DRAM, ASIC and PC controller manufacturers. Currently, eight of the world's top-10 semiconductor companies license Rambus technology. More information on the company and its high-bandwidth interface technology is available at www.rambus.com. Rambus Inc., 2465 Latham Street, Mountain View, Calif. 94040, telephone 650/944-8000.
Note: Rambus and RDRAM are registered trademarks of Rambus Inc., and RIMM and SO-RIMM are trademarks of Rambus Inc. Scalable by Design is a trademark of Toshiba America Electronic Components Inc. DRAM 99 208.
EDITORS NOTE: Reader inquiries publish 800/879-4963, Ext. 208
CONTACT: Toshiba America Electronic Components, Inc.
Lisa Nemec, 949/455-2293 (not for reader inquiries)
lisa.nemec@taec.toshiba.com
For reader inquiries publish 800/879-4963, Ext. 208
or
The Benjamin Group Inc.
Jan Johnson or Suzanne Foxworth
714/245-7500
jan_johnson@benjamingroup.com or
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