SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: kapkan4u who wrote (82557)6/3/1999 1:38:00 PM
From: Paul Engel  Respond to of 186894
 
Kal Kan - Re: "If a material could be found that acts as both a diffusion barrier and a low-k dielectric, would the copper interconnect scaling be as good as the aluminum ones?"

Absolutely NOT.

If it is a dielectric - it is a NON-CONDUCTOR.

When a non-conductor takes up limited FIXED space that a CONDUCTOR should occupy, the net cross sectional area of the CONDUCTOR is reduced, and the benefits of reduced electrical resistivity are DIMINISHED.

Paul



To: kapkan4u who wrote (82557)6/3/1999 2:47:00 PM
From: Process Boy  Read Replies (1) | Respond to of 186894
 
kapkan - <If a material could be found that acts as both a diffusion barrier and a low-k dielectric>

What material do you have in mind? It'd be a neat trick.

PB


HomeMailHotSubjectMarksPeopleMarksKeepersSettings
Terms Of UseContact UsCopyright/IP PolicyPrivacy PolicyAbout UsFAQAdvertise on SI
© 2025 Knight Sac Media.  Data provided by Twelve Data, Alpha Vantage, and CityFALCON News