Taiwan makers look to demand for thin heat-pipes used in smartphones
Aaron Lee, Taipei; Adam Hwang, DIGITIMES [Tuesday 8 April 2014]
Sony Mobile Communications has adopted thin heat-pipes for its Xperia Z2, and Taiwan-based thermal module makers hope that other smartphone vendors will follow suit, according to Taiwan-based supply chain makers.
Japan-based vendor NEC took the initiative to use heat-pipes in its 4.7-inch Media X06E in 2013, and since then Samsung Electronics and Lenovo have cooperated with Taiwan-based thermal module makers to develop thin heat pipes specifically for use in smartphones, the sources indicated. However, Samsung and Lenovo have not yet decided to adopt such heat-dissipation components for smartphones, the sources pointed out.
Japan-based Furukawa Electric and Fujikura as well as Taiwan-based Chaun Choung Technology, TaiSol Electronics, Auras Technology, Asia Vital Components and Yeh-Chiang Technology have developed thin heat-pipes for use in smartphones, the sources noted.
While heat-pipes used in PCs range from 1mm to 2mm in diameter, models for use in ultrabooks and tablets have smaller diameters of 1-1.2mm and 0.8mm respectively. Models specifically for smartphones with a diameter of 0.6mm have been developed and are ready for volume production, with heat-dissipation effects better than those for graphite carbon fiber which is currently the mainstream heat-dissipation material for smartphones, the sources indicated.
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