TI Chipsets for 802.16d/e WiMax and WiBro ...
... are now sampling.
It should be noted that although TI is active in 802.16 as is QUALCOMM, neuther TI or QUALCOMM are members of WiMAX Forum.
>> TI's RF chipsets support WiMAX and WiBro
News Story from Texas Instruments
Edited by the Electronicstalk Editorial Team
25 April 2005
electronicstalk.com
Texas Instruments has expanded its portfolio of complete wireless signal-chain solutions for broadband wireless access, introducing three new radio frequency chipsets.
Texas Instruments has expanded its portfolio of complete wireless signal-chain solutions for broadband wireless access, introducing three radio frequency (RF) chipsets, the TRF11xx chipset at 2.5GHz, the TRF12xx chipset at 3.5GHz and the TRF24xx chipset at 5.8GHz.
TI's new chipsets are designed to support IEEE802.16d/e standard RF front end for wireless basestations, access points as well as equipment backhaul, point-to-point microwave and public safety band applications.
These new chipsets are capable of supporting both emerging WiMAX and WiBro applications based on the IEEE802.16 standard, as well as the more traditional fixed wireless access.
'TI is working with equipment providers to build a solid foundation to deploy any type of broadband infrastructure demanded in the future', said David Briggs, TI's Analog Wireless Infrastructure Business Manager.
'We understand that as carriers look to incorporate the newest applications that they expect technologies, such as 802.16, to be readily available'.
'TI is best equipped to ensure that equipment providers have the tools and flexibility they need to support emerging access technologies in the shortest timeframe'.
Both the TRF112xx chipset at 2.5GHz and the TRF122xx chipset at 3.5GHz consist of four chips, each with fully integrated super heterodyne receivers and transmitters.
These RF chipsets are capable of supporting frequency division duplex (FDD), half frequency division duplex (HFDD) and time division duplex (TDD) modes with a real interface at low IF to the data conversion subsystem.
TI's flexible RF chipsets are compliant with today's demanding mask requirements, and the receivers feature excellent sensitivity and blocker suppression.
The TRF11xx at 2.5GHz and the TRF12xx at 3.5GHz are also complemented by the optimised power amplifiers, TRF1123 and TRF1223.
Supporting a range of frequencies between 2.1-2.7 and 3.3-3.8GHz, these power amplifiers provide excellent output third order intercept point (OIP3) of 45dBm or better, enabling the support of complex OFDM (orthogonal frequency division multiplexing) signals.
These power amplifiers can also be used as driver amplifiers in applications requiring larger output power.
TI's new TRF2432 and TRF2436 heterodyne transceiver chipset is the most integrated solution available, with two chips.
Consisting of an IF and RF transceiver, the chips support the 4.9-5.9GHz air interface frequency band.
The chipset supports TDD mode with complex I/Q interface.
This highly integrated chipset reduces space, making for easier design while saving bill of material (BOM) cost.
TI offers a complete analogue signal chain solution for wireless infrastructure OEMs with its ADS5500 analogue-to digital-convertor (ADC) and its DAC5687 digital-to-analogue convertor.
Both convertors can be supported by the digital up or down convertor, GC5016 which is capable of handling wide bandwidths of up to 20MHz.
The CDC7005 can simultaneously clock each of these mixed signal chips with low jitter performance, maximising the performance capabilities of particular ADCs.
TI also offers a next generation programmable digital signal processor (DSP) capable of handling multiple air interface standards and a range of basestation form factors on a single chip.
The TMS320TCI6482 DSP at 1GHz performs at nearly twice the clock speed of other available solutions, yet consumes only 3W of power, making it the industry's most power efficient DSP for wireless infrastructure systems.
TI's flexible chipsets and complete signal chain offerings enable OEMs to support new technologies in the most cost-effective manner.
All three TI chipsets - the TRF11xx at 2.5GHz, the TRF12xx at 3.5GHz and the TRF24xx at 5.8GHz - are now sampling. <<
- Eric - |
