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Pastimes : The Hot Button Questions:- Money, Banks, & the Economy

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To: maceng2 who wrote (391)	8/24/2003 9:26:12 AM
From: maceng2	Read Replies (2) of 1417

On 25 mm wafers for Chips or thereabouts. I have been posting a number of ideas concerning the use of 25 mm silicon wafers instead of the 300 mm industry standard that is now underway. Of course there will be a huge amount of 200 mm and 150 mm capacity made available that should keep the world in adequate silicon chip manufacturing capacity for some time to come. The idea originates from a post on the possibility to manufacture diamonds cheaply. I would expect the first manufacturing lines to uses fairly small diamond wafers. Back to silicon though. Why not 25 mm wafers?? This is what modern chips look like.. Message 19228274 facsnet.org When a modern stepper exposes a wafer it is done one die at a time. Maybe a few die at a time max. This includes the "step and scan" tools as well. At very fine geometries and alignment, silicon becomes more like a wobbly blamanche then a rigid structure. Then there is the concept of a round die instead of a square one.. Message 19213434 Message 19229287 siliconinvestor.com siliconinvestor.com (Thanks DJ for the general tips and ideas..) siliconinvestor.com apparent show stopper.. siliconinvestor.com Now, forget economies of scale etc and consider this. Lets say you wanted to make a chip that sold for a thousand bucks. How could that be done?? -fastest. Finest geometries run at the highest power (watts). See post on exposure optics. Max uniformity on all tools will be over a small area too. -unique manufacturing process that can be retooled for big upgrades quickley at minimum retooling costs. I can probably think of others, but the masking coating and developing issue takes a back seat on a die that can be sold for a $1000 or over. To be regarded as a technological barrier that can be lowered probably with a little work. voila!

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