| | | Slight decline in Capx billings but still stronger than each month in Q1
MILPITAS, Calif. — July 25, 2019 — North America-based manufacturers of semiconductor equipment posted $2.01 billion in billings worldwide in June 2019 (three-month average basis), according to the June Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 2.5 percent lower than the final May 2019 level of $2.07 billion, and is 19 percent lower than the June 2018 billings level of $2.48 billion.
“June billings of North American equipment manufacturers fell nearly three percent when compared to the prior month,” said Ajit Manocha, president and CEO of SEMI. “While billings weakened for the most recent month, total global billings of suppliers based in North America for the most recent quarter are stronger than their first-quarter 2019 billings.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
-------------------------------Billings ------------------------------- (3-mo. avg.) ------------------------------- Year-Over-Year
January 2019
| $1,896.3
| -20.0%
| February 2019
| $1,868.1
| -22.7%
| March 2019
| $1,825.3
| -24.9%
| April 2019
| $1,922.0
| -28.5%
| May 2019 (final)
| $2,065.2
| -23.6%
| June 2019 (prelim)
| $2,012.7
| -19.0%
|
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org
Notes Next SEMI Billings report is August 22, 2019 at 3:00pm Pacific For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp |
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