SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Non-Tech : Kirk's Market Thoughts
COHR 148.38+6.4%10:16 AM EST
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
Recommended by:
Sam
To: Sam who wrote (3370)7/27/2020 10:51:19 AM
From: Kirk ©1 Recommendation   of 26598
 
Here is an article that at least confirms my earlier comment that I thought Intel ALREADY did business with TSMC via its Altera purchase.

Highlights of the day: Intel may expand partnership with TSMC
DIGITIMES staff
Monday 27 July 2020

As Intel is facing troubles to improve its manufacturing processes, the CPU giant is now seeking outside help in production of some of its processors with TSMC having a high chance to be one of the partners. Meanwhile, PCB makers Zhen Ding and AT&S now together supply 60% of SLP used in iPhones and Apple Watch, leaving about 40% shared among smaller suppliers. Because of the uprising opportunity of 5G, ASE has been increasing its capacity of FC-AiP packaging and is looking to stay at the top of the industry for the 5G sector.
TSMC EUV nodes to attract orders from Intel, sources say: Intel at its recent earnings call disclosed that its next-generation 7nm processors, including the company's first 7nm datacenter GPU design, would rely on external and internal process technologies, sparking speculation about TSMC being its potential foundry partner.
Zhen Ding, AT&S lead in SLP mainboard supply for iPhones, Apple Watch: SLP (substrate-like PCBs) makers in the supply chain of Apple devices have ended their first wave of competition, with Taiwan's Zhen Ding Technology and Austria's AT&S each absorbing 30% of orders for iPhone and Apple Watch applications, according to industry sources.

ASE ramping up FC-AiP packaging capacity: ASE Technology Holding has continued committing equity investments to build up its FC-AiP (flip chip-antenna in package) packaging capacity seeking to maintain its leading position in the sector, according to industry sources.
digitimes.com
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  

HomeMailHotSubjectMarksPeopleMarksKeepersSettings
Terms Of UseContact UsCopyright/IP PolicyPrivacy PolicyAbout UsFAQAdvertise on SI
© 2025 Knight Sac Media.  Data provided by Twelve Data, Alpha Vantage, and CityFALCON News