SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : MEMC INT'L. (WFR -NYSE) The Sleeping Giant?

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Carl R. who wrote (3668)8/3/1998 9:11:00 AM
From: Jonathan Edwards  Read Replies (2) of 4697
 
IBM has announced a breakthrough in silicon-on-insulator technology. Here is an excerpt (see chips.ibm.com for more details):

IBM's unique SOI process protects the millions of tiny transistors on a chip with a "blanket" of insulation, reducing harmful electrical effects that sap energy and hinder performance. IBM engineers have manufactured SOI chips that improve performance by up to 35 percent -- translating into faster computers and communications gear. For example, a microprocessor designed to operate at 400 MHz could instead be built using SOI and could achieve speeds over 500 MHz.

At the same time, if performance levels are held constant, SOI chips can require as little as one-third the power of today's microchips. This is an important development since reducing the power necessary to operate chip circuitry can significantly extend the battery life of portable devices such as cell phones, mobile computers and personal digital assistants (PDAs). IBM believes the low-power aspects of SOI technology will be key to the creation of multifunction, hand-held "information appliances" of the future.

The technology industry has been pursuing silicon-on-insulator technology for more than 15 years in an attempt to address the technology requirements of an increasingly diverse array of electronic products. The company's breakthrough allows IBM to build SOI chips in a high-volume manufacturing environment. As with its announcement of copper interconnect technology last year, IBM believes its approach to be the first commercially viable implementation of SOI for mainstream applications. The company intends to incorporate SOI in its chip products beginning next year.


WFR and IBM had a joint venture (SiBond) to develop SOI wafers. I think I'll email IR and ask them whether IBM's announcement has anything to do with it or not...
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext