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Technology Stocks : Mattson Technology -- Ignore unavailable to you. Want to Upgrade?

To: Philip W. Dunton, Jr who wrote (1402)	6/22/1999 9:53:00 AM
From: Ian@SI	Read Replies (3) \| Respond to of 3661

Yeeeeeesssss! or should that be YEEEEE-HAWWWWW! MTSN scores bigtime with a CVD sale. John S., Outstanding prediction. Ian. +++++++++++++++++++ Tuesday June 22, 8:32 am Eastern Time Company Press Release Mattson Technology Gains Market Share With New Bridge Tool DRAM Leader Places Multimillion Dollar Order for New 200/300mm CVD System FREMONT, Calif.--(BUSINESS WIRE)--June 22, 1999--Mattson Technology (Nasdaq:MTSN - news) today announced that it has received an order in excess of 10 million dollars for multiple Aspen III CVD systems from a major DRAM manufacturer. The Aspen III CVD system may be the industry's first successful example of a 200/300mm bridge tool that can use the same chamber to process either 200mm or 300mm wafers. During the past three years, Mattson Technology has been working closely with key customers to ease the transition from 200mm to 300mm wafer processing. Mattson Technology has 300mm development work in progress with leading edge semiconductor makers around the world, including a consortium in Japan and I300I in North America. The company already has Aspen III Strip and CVD equipment running in leading edge semiconductor facilities around the world, including Aspen Strip systems running production at SEMICONDUCTOR300, the Infineon Technologies/Motorola 300mm production fab in Europe. The company estimates it will have more than 20 Aspen III systems installed by the end of 1999 with a majority of the systems running 200mm processes. This gives Mattson substantial lead-time to prove the production-worthiness of its 300mm platform. ''This is a major achievement for a new product introduction in a competitive market like CVD. When we designed the new platform for 300mm processing, we knew we had to be prepared for possible delays in the changeover,'' said Brad Mattson, CEO of Mattson Technology. ''By designing the Aspen III CVD to use the same process chamber for both 200mm and 300mm processing, we are able to prove the system's capabilities in production before the 300mm ramp hits,'' he added. The Aspen III CVD system deposits silane-based films such as oxide, oxynitride and nitride, as well as TEOS-based (tetraethylorthosilicate) oxide films. Mattson offers a full suite of CVD applications: ARC layers for excellent CD control; etch stop layers for use with low k materials; passivation layers; IMD underlayers, low temperature capping layers, low k FSG; and gate oxide nitridation. Depending on the type of film deposited, the Aspen III CVD has the capability to process up to 180 wafers per hour -- higher throughput than the original Aspen II platform, which set new industry standards when it was introduced in 1991. BRIDGING THE GAP BETWEEN 200MM & 300MM MANUFACTURING The Aspen III CVD system is the first true CVD bridge system in the industry. While other 300mm systems may require new process chambers to convert to 200mm, the Aspen III CVD can be converted to either 200mm or 300mm manufacturing with only a few minor modifications to the cassette or FOUP stations. The system is a fully automated plasma-enhanced chemical vapor deposition (PECVD) system used for depositing silane-based and TEOS films on either 200 mm or 300 mm wafers for a variety of leading edge process applications. The flexible system design addresses the needs of large volume manufacturing where cost is a major consideration, such as DRAM, as well as small volume production of ASIC and logic devices. Aspen III CVD has the smallest footprint available in 200 and 300 mm PECVD tools and provides up to a 50% throughput advantage for selected thin film applications. Customers are finding the Aspen III CVD system cost effective to purchase for 200mm applications because it has the additional capability to move to 300mm manufacturing in the future. ABOUT MATTSON TECHNOLOGY Mattson Technology Inc., is a leading supplier of semiconductor process equipment for photoresist strip/etch, chemical vapor deposition, epitaxial and rapid thermal processing. The company's products combine advanced process technology on a high productivity platform, backed by industry-leading support. Since beginning operations in 1989, the company's core vision has been to bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, the company maintains sales and support centers throughout the United States, Europe, Asia/Pacific and Japan. For more information, please contact Mattson Technology Inc., 3550 W. Warren Avenue, Fremont CA 94538. Telephone: (800) MATTSON. Fax: (510) 657-0165. Internet: www.mattson.com. -------------------------------------------------------------------------------- Contact: Mattson Technology Inc. Lindsey Mitobe, 510/492-6334 or The Loomis Group, Inc. Jennifer Joelson, 415/882-9494