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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: kash johal who wrote (63255)	6/24/1999 9:40:00 PM
From: Process Boy	Read Replies (1) \| Respond to of 1572500

kash - Thanks for your response. One follow-up: <I am hearing that Cu speeds up interconnect delays by 25-30%.> I take it this is specific to the K7 design. PB

To: kash johal who wrote (63255)	6/24/1999 10:32:00 PM
From: grok	Respond to of 1572500

RE: <I am hearing that Cu speeds up interconnect delays by 25-30%.> This will be very sensitive to the actual design of the chip but the only data I've seen comes from Tom Riordan of QED who presented a new MIPS chip at Embedded Processor Forum in April. He said that copper contributed 8%.

To: kash johal who wrote (63255)	6/25/1999 12:05:00 AM
From: kapkan4u	Read Replies (2) \| Respond to of 1572500

<Kash - re: BTW, one of the CC comments that was made was the 0.18 K7 wafers had been started.> Was he talking about 0.18Cu (Fab30) or 0.18Al (Fab25) process? Kap.

To: kash johal who wrote (63255)	6/25/1999 1:09:00 AM
From: RDM	Respond to of 1572500

<That means that the chip design and layout is already complete> My feeling was at Dirk's Dinner speech both .18 micron aluminum and copper design variations were complete although he did not directly state that.