Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Amkor Technology Inc (AMKR) -- Ignore unavailable to you. Want to Upgrade?

To: JZGalt who wrote (266)	7/6/1999 1:51:00 PM
From: tech101	Read Replies (2) \| Respond to of 1056

Amkor Supports Stacked Chip-Scale (CS)packages A service of Semiconductor Business News, CMP Media Inc. Story posted 8 a.m. EST/5 a.m., PST, 7/6/99 TOKYO--Four major semiconductor companies announed thay have agreed to standardize specifications for stacked chip-scale packages (S-CSP), a multiple memory module for mobile communications and hand-held computing applications. Sharp Corp. and Mitsubishi Electric Corp. first proposed the S-CSP specifications last September. Joining them in the standardization effort are Hitachi Ltd. and Intel Corp. In addition, five other packaging and assembly companies -- Seiko Epson, Sanyo Electric, Mitsui High-tec, Amkor Technology, and Power Technology -- have announced they will support the unified S-CSP specifications. The specification standard of S-CSP with Flash memory and SRAM chips stacked in one package includes compatibility of pin assign; unification of ball layout and ball pitch, calling for 64-pin, 72-pin, and 0.8-mm ball pitch; and unification of package size, which calls for 8x8-, 8x10-, 8x11-, and 8x12-mm, with a maximum height of 1.40-mm. It is hoped that expanding the unified specifications group will help meet the demand for S-CSP products, which have been in volume production since April 1998. Adding two new members, Hitachi and Intel, will help speed its adoption as a de facto standard for the world semiconductor industry, they said. In addition, the group will contribute to the diversification of S-CSP devices and will also support users by creating smaller, lighter and highly reliable advanced products in applications markets including mobile phones and hand-held computers. 204.247.196.14