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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Saturn V who wrote (65015)	7/13/1999 11:24:00 AM
From: Steve Porter	Read Replies (2) \| Respond to of 1579985

SaturnV, I am aware that the K6-2 would require a re-layout to go to a wire-bonded type of 'connection'. Let's rephrase my point. If AMD does research that shows that $35 dollar ASP k6-2s are a viable product from both a sales and profit point of view going forward, one would expect them to want to reduce costs as much as possible, and in my opinion the first thing thye would need to get rid of (with or without process shrink) is the expensive ceramic packaging. Now as you mentioned, currently they are stuck with cermaic packaging due to the flip chip tech, but also due to heat. Further more correct me if I'm wrong but doesn't flip chip have low yields (relative to the other more 'established' techniques. As for wire bond adding 'L' to vcc and vss, I'm sure it wouldn't be that severe at (let's guestimate) 1.6 volts for a .18 micron k6-2 at say 600mhz. Regards, steve