To: Mr. Sam who wrote (3470 ) 8/9/1999 8:53:00 PM From: SemiBull Read Replies (1) | Respond to of 3736
Any opinons on the new head of CMP R&D? SpeedFam-IPEC Appoints William Kabele Vice President, Research and Development, CMP Group CHANDLER, Ariz.--(BUSINESS WIRE)--Aug. 9, 1999--SpeedFam-IPEC, Inc. (Nasdaq:SFAM - news), a leading supplier of high-throughput chemical mechanical planarization (CMP) systems for the semiconductor industry and flat surface processing systems for the thin film memory disk media and silicon wafer industries worldwide, today announced the appointment of William C. Kabele as vice president, research and development, for the company's CMP Group. Kabele is a 25-year veteran of high technology. Before joining SpeedFam-IPEC, he spent seven years in general management for various business units and product lines at Tektronix, Inc. These included the Design Tools and Accessories and Performance Oscilloscope groups, both $100-million-plus business units for which Kabele had profit-and-loss responsibility. ``Bill brings significant breadth and depth of operating experience to the SpeedFam-IPEC management team,' said Ralph D. Hartung, chief operating officer and president of the CMP Group. ``At Tektronix, he consistently demonstrated his ability to turn market share erosion into renewed market share gains for critical product lines. His proven track record in driving measurable performance improvement is precisely what we need to achieve and sustain our technological leadership of the copper process segment of the CMP industry.' Prior to Tektronix, Kabele was vice president, export operations, and vice president and general manager, Systems Division, at Keithley Instruments, Inc. He also held various project, engineering, marketing, and product line management positions at LTX Corporation and GenRad, Inc. Kabele earned an MSEE degree from the University of Illinois and a BSEE degree from Rensselaer Polytechnic Institute. He is also a graduate of the Stanford Executive MBA Program and the Northeastern University Management Development Program. SpeedFam-IPEC, Inc. SpeedFam-IPEC, Inc. designs, develops, manufactures, markets and supports chemical mechanical planarization (CMP) systems used in the fabrication of semiconductor devices and other high-throughput precision surface processing systems. SpeedFam-IPEC's flat surface processing systems are used in the thin film memory disk media, silicon wafer and general industrial components markets. The company also markets and distributes polishing liquids (slurries), parts and consumables used in its customers' manufacturing processes. SpeedFam-IPEC, Inc. owns a 50-percent interest in each of two joint ventures, SpeedFam-IPEC Co., Ltd. (the Far East Joint Venture) and Fujimi Corporation. This press release contains forward-looking statements relating to leveraging synergies from the combined company and growth in the CMP market. Actual results may vary. The combined company may face difficulties successfully integrating operations. Expenses related to the merger and difficulties retaining employees may adversely affect the combined company. Research and development programs may not be successful in developing products and processes that address the needs of customers. The CMP market may not grow. Competitive conditions in the industry and technological changes may affect the market for CMP equipment and the timing of CMP growth in Asia is uncertain. See SpeedFam and IPEC's filings with the SEC for additional risks affecting the combined company.