SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?


To: Dan3 who wrote (69552)8/22/1999 6:28:00 PM
From: Gopher Broke  Read Replies (1) | Respond to of 1574281
 
Although apparently the Dresden fab is particularly advanced in terms of isolating against contaminants. The chips are carried in a "pod" throughout the different processes. They may well be able to do Al and Cu on the same site.

I would guess that, while Cu is a better technology, .18 Al was more attainable in the short term. We will see .18 Al out of Fab 25 at least 3 months before .18 out of Fab 30 I believe?



To: Dan3 who wrote (69552)8/22/1999 7:02:00 PM
From: Yousef  Read Replies (1) | Respond to of 1574281
 
Dan3,

Re: "Thanks for your post, that is another good reason for separate FABS."

It's good to see you learning the basics about IC processing with Copper.
It might be a "good idea" to understand these thoroughly before investing
in AMD ... It probably would be better for you to stick to HYPE'ing AMD
until then, IMHO.

Make It So,
Yousef




To: Dan3 who wrote (69552)8/22/1999 11:56:00 PM
From: Process Boy  Respond to of 1574281
 
dan3 & nus - <Re: al and cu don't mix well

Thanks for your post, that is another good reason for separate FABS.>

Aluminum and copper exist just fine. Copper won't hurt Al, or vice versa.

However, the two technologies require two different equipment sets, and if they are so inclined, fab layouts that protect the front end of the line from copper.

PB