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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Yousef who wrote (72370)9/20/1999 2:56:00 AM
From: Process Boy  Respond to of 1572453
 
Yousef - <There are tremendous differences in ILD gap fill
between copper damascene and traditional Aluminum processing. In fact,
this is one of the major processing advantages of damascene. The reason is that once you have etched a trench, filled with copper, and then polished ... You have a very flat surface on which to deposit the next ILD. Expensive, complicated ILD deposition techniques are not needed in damascene processing.>

Thanks for the explanation on the merits of damascene, which is, as you've implied, a very elegant topographical feature.

PB



To: Yousef who wrote (72370)9/20/1999 8:23:00 AM
From: Dan3  Read Replies (1) | Respond to of 1572453
 
Re: once you have etched a trench, filled with copper, and then polished ...

Thanks for an interesting post. Your adjectives sound very positive about the process - it's good to hear the benefits. How about the other side of penny :-) Are there any problems associated with polishing the copper surface? Seems as though that would be tricky with a relatively soft metal that has in other place been described as difficult to keep from spreading around.

Dan


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