QUALCOMM CDMA Technologies Announces
Sample Shipping of Its Sixth Generation CDMA Chipset Solution
- Highly Integrated MSM3100 Mobile Station Modem Provides 50 Percent Size Reduction with
Increased Standby Time of Up to 300 Hours -
NEW ORLEANS, PCIA PCS'99 Booth #4120, Sept. 22 /PRNewswire/ -- QUALCOMM Incorporated (Nasdaq: QCOM
- news), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced
the on- time shipment of samples of its sixth-generation CDMA chipset and system software solution including the
MSM3100(TM) Mobile Station Modem (MSM(TM)), the RFT3100(TM) transmit (Tx) processor, the PM1000(TM) power
management chip and the SURF3100(TM) Subscriber Unit Reference Development System. This latest generation solution
features an increased level of integration allowing a 50 percent reduction of the printed circuit board area and up to 300 hours
of standby time enabling manufacturers to quickly design very small, feature- rich handsets with longer standby times and
support for higher data rate services.
''We remain committed to being the first to deliver leading-edge CDMA solutions and keeping our promised delivery dates. At
the CTIA trade show in February 1999, we announced we would ship the MSM3100 chipset and system software samples to
customers by September -- we've delivered our promise on time,'' said Don Schrock, president of QUALCOMM CDMA
Technologies. ''The MSM3100 solution will drive the next generation of powerful, yet compact handsets allowing our
customers to further innovate and differentiate their handsets while reducing time to market.''
The MSM3100 chipset and system software provides a higher level of integration and cost savings while adding support for
new high performance voice and data processing features. The chipset and system software is IS-95B compliant with support
for data rates up to 86.4 kilobits per second (kbps). New system software and hardware provides for enhanced system power
control delivering up to 300 hours of standby time, a 50 percent increase over the previous generation MSM.
The MSM3100 chip integrates various analog cores, advanced QDSP2000(TM) digital signal processing (DSP) core and a
Universal Serial Bus (USB) interface. Higher on-chip integration includes a 13-bit linear audio voice codec with Automatic
Gain Control (AGC) function and integrated earphone amplifiers and other analog cores including a phased-lock loop (PLL),
digital-to-analog converters (DACs) and analog-to-digital converters (ADCs). This integration facilitates a 50 percent size
reduction of the printed circuit board area as well as a significantly reduced part count and lower bill-of-materials cost for
handset manufacturers.
QUALCOMM CDMA Technologies' newly developed QDSP2000 digital signal processing (DSP) core easily enables
advanced features such as voice recognition, speech compression, acoustic echo cancellation, noise suppression, and other
audio enhancements. Acoustic echo cancellation support in the QDSP2000 core eliminates the need for DSP's in car-kits for
additional cost savings.
A Universal Serial Bus (USB) device controller is integrated on the MSM3100 chip for easy interconnection to a PC or car kit.
With the greatly increasing popularity of USB in the PC marketplace, this interface is ideal for plug-and-play mobile phone
connections to PC's and consumer appliances.
QUALCOMM CDMA Technologies MSM3100 baseband processing solution operates directly with the
IFR3000(TM)receive processor, the RFT3100(TM) transmit processor and the PM1000 power management chip forming the
most complete CDMA transmit/receive and power management chipset solution to date. The new system software has been
developed to provide optimized system performance and control for the chipset.
The RFT3100 baseband-to-RF Transmit Processor performs all transmit signal processing functions required between digital
baseband and the power amplifier (PA) for IS-95 CDMA cellular and PCS single-band and dual-band applications. The
PM1000 chip is a full-featured power management system device available for CDMA handset applications. It includes battery
charging systems for use with regulated and unregulated charger packs, programmable voltage regulation for all digital and
IF/RF circuitry, and integration of many collateral functions to facilitate lower cost and quicker handset development.
System development software, verification, test, debug, calibration, manufacturing and field test support are available using the
CDMA Designer(TM) development tools reducing time to market for a complete CDMA handset. The SURF3100 Subscriber
Unit Reference Development System, an essential element in the CDMA Designer toolkit, is a working example of the
interfaces between QUALCOMM CDMA Technologies' CDMA chipset and other functional parts of the subscriber unit.
Combined with new tools and our world-class technical support staff, this ensures continued industry leading handset
development times for our customers.
Samples of the MSM3100, RFT3100 and PM1000 chips are now available with production volumes starting by the end of the
year. The IFR3000 is currently available in production quantities.
QUALCOMM CDMA Technologies is the leading developer and supplier of CDMA chipsets, hardware and software
solutions and tools with more than 50 million MSM chips shipped worldwide. The division supplies chipsets to the world's
leading CDMA handset and infrastructure manufacturers including: Acer Peripherals, Inc., ALPS ELECTRIC CO., LTD.;
CASIO COMPUTER CO., LTD.; DENSO CORPORATION; FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics
Industries Co., Ltd.; KYOCERA CORPORATION; LG Information and Communications, Ltd.; Samsung Electronics Ltd.;
SANYO Electric Co., Ltd.; and Toshiba Corporation, among others.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless
communications products and services based on the Company's CDMA digital technology. The Company's major business
areas include CDMA phones; integrated CDMA chipsets and system software; technology licensing; and satellite-based
systems including OmniTRACS® and portions of the Globalstar(TM) system. Headquartered in San Diego, Calif.,
QUALCOMM is included in the S&P Index and is a 1999 FORTUNE 500® company traded on the Nasdaq under the ticker
symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to
risks and uncertainties, including timely product development, the Company's ability to successfully manufacture significant
quantities of CDMA or other equipment on a timely and profitable basis, and those related to performance guarantees, change
in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the
Company's SEC reports, including the report on Form 10-K for the year ended September 27, 1998, and most recent Form
10-Q.
QUALCOMM is a registered trademark and OmniTRACS is a registered trademark and service mark of QUALCOMM
Incorporated. MSM, MSM3100, IFR3000, RFT3100, PM1000, QDSP2000 and CDMA Designer are trademarks of
QUALCOMM Incorporated. Globalstar is a trademark of Loral QUALCOMM Satellite Services, Incorporated. All other
trademarks are the property of their respective owners.
SOURCE: QUALCOMM Incorporated
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