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To: FJB who wrote (23117)	9/24/1999 11:27:00 PM
From: George Coyne	Respond to of 25960

Par for the course on any BBS. Which reminds me, why does the US suck in the Ryder Cup? Can anyone answer that? Bob, It is, for golfers, the unaccustomed pressure from a source other than internal. G. W.

To: FJB who wrote (23117)	9/25/1999 3:39:00 AM
From: Mani1	Read Replies (1) \| Respond to of 25960

Robert Re <<Mani messed up with the over 100 wafers per hour on 300mm and ASP things>> Currently there does not exist any stepper in operation that does 100 WPH on 300mm. But we are headed that way, very soon. Currently there exist lines in the industry that processes 110 wafers per hour on 0.25 on 200mm. That is from only one stepper. Industry trends are: the continuos shrinking of IC's, expansion of wafers size (currently from 200mm to 300mm) and increasing through put from each stepper(lasers). All these three trends results in lower growth (than other wise) for steppers and scanners compared with back end equipment which do not have ALL these disadvantages. As far as the ASP's are concerned I did not make any particular guess. Perhaps you could clarify what you mean by "Mani messed up with ... ASP things" Also Re <<They are not trying to understand each other anyway, so no harm done.>> Not true. I was trying to understand him, and I think I did. Mani