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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Bill Jackson who wrote (73132)	9/26/1999 1:18:00 AM
From: Yousef	Read Replies (1) \| Respond to of 1571554

Bill, Re: "Is it traces of copper being carried in water?, or mechanical deposition of a few cooper atoms in a depositon stage?" One of the key steps is the cleaning of wafers after Copper polishing. To polish Copper, a slurry and pad are used to chemically/mechanically "grind" the Copper off the wafers. Any traces of Copper left after polish and clean on top of the oxide, (Copper in trenches are surrounded by barrier film) will contaminate the wafer at the next high temperature oxide deposition step. I'm sure one has to also worry about the edge of the wafer and having Copper come off due to "handling" in equipment. I'm more worried that this process will have very poor yield and be late at Dresden. Hope this helps. Make It So, Yousef