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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Elmer who wrote (75279)	10/13/1999 12:13:00 AM
From: Bill Jackson	Read Replies (1) \| Respond to of 1573816

Elmer, I see the problem, the pincushion effect, like the 370 socket. I have often wondered if they could make a large memory chip and have it face the CPU like a ham and cheeze sandwich with bread being the heat exchange surfaces and have vertical connection from the CPU to the memory with 'bump' type connections. It seems to me that with 30 million transistors on a CPU the facing memory could have the same or even more cells of memory(it could be larger in area, but have the bump connections in the common facing area) Memory is down to .13, is it not, so the possibility exists for 64M or so in this manner. Does memory make the same amount of heat as CPU per unit area(I suspect less??) Can you make a 3-4-5 decker 'sandwich' this way? I suspect you may need an interlayer heat transfer fluid for those layers not bonded to a heat exchange surface. Bill