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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Bill Jackson who wrote (75284)	10/13/1999 12:34:00 AM
From: kash johal	Read Replies (1) \| Respond to of 1573850

Bill, Re:"I have often wondered if they could make a large memory chip and have it face the CPU like a ham and cheeze sandwich with bread being the heat exchange surfaces and have vertical connection from the CPU to the memory with 'bump' type connections. It seems to me that with 30 million transistors on a CPU the facing memory could have the same or even more cells of memory(it could be larger in area, but have the bump connections in the common facing area) Memory is down to .13, is it not, so the possibility exists for 64M or so in this manner. Does memory make the same amount of heat as CPU per unit area(I suspect less??) Can you make a 3-4-5 decker 'sandwich' this way? I suspect you may need an interlayer heat transfer fluid for those layers not bonded to a heat exchange surface." I think the ham and cheese nor the club-house sandwiches are viable unfortunately due to expense and yield reasons. I suspect that we are stuck with the old world pizza approach with ham, cheeze, peperoni next to each other connected to each other with lotsa cheese. regards, Kash