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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Charles R who wrote (76056)	10/19/1999 1:34:00 PM
From: Paul Engel	Read Replies (1) \| Respond to of 1580148

Chuckles - Re: "the assumption is that Fab25 does nothing but K6-2. I wonder how valid that assumption is. " It is valid. Re: "I am pretty sure AMD runs other stuff on the same lines ": No you're not - otherwise you would have posted your supporting evidence. Paul

To: Charles R who wrote (76056)	10/19/1999 2:32:00 PM
From: Goutam	Read Replies (1) \| Respond to of 1580148

Chuck, Another DDR SDRAM forward motion - with VCM core: Update: Nintendo console to use NEC's embedded DDR SDRAM and VCM core ebnews.com _________________ In what reportedly is the first full-scale adoption of an embedded double-data-rate SDRAM incorporating its Virtual Channel Memory core, NEC Corp. yesterday signed a $2.7 billion deal to supply the chips for Nintendo Corp.'s new Dolphin game console. As previously reported by EBN, NEC will build the devices on a 0.13-micron-process line the company is installing at a new fab within its Fab 8 manufacturing site in Kyushu, Japan. Although an NEC spokesman declined to disclose specific performance or density data, sources said the embedded DDR device will be capable of a 3.2-Gbyte/s data transfer and integrates the VCM core developed by subsidiary NEC Electronics Inc. to further boost speed. In addition to embedded DRAM, the chip will integrate a graphics accelerator core designed by ArtX Co., Palo Alto, Calif. The Dolphin game machine will be powered by the Gekko microprocessor, a 400-MHz customized PowerPC device from IBM Corp., which won out over the NEC MIPS 4300 processor used in existing Nintendo boxes. Having already received JEDEC approval for a single-data-rate SDRAM using its VCM technology, NEC is in the process of formalizing a DDR VCM specification. The new production line will use extended 248-nanometer krypton fluoride laser lithography and copper interconnects, the NEC spokesman said. NEC's Sagamihara development fab already is in pilot production using copper at 0.15-micron linewidths. The Kyushu line, slated to start production in 2000, will have a monthly capacity of 10,000 8-in. wafers. The same 248-nm extended-0.13-micron design-rule lithography tools are being installed in a new NEC logic fab in Yamagata. The fab also will be the first to use the company's UX4 single system-on-a-chip production system, beginning next April. NEC said the UX4 process solves one of the most perplexing production problems for system-on-a-chip designers: the fabrication of disparate logic and memory functions on the same die. NEC said it has redesigned the basic transistor structure of a system-on-a-chip, optimizing both the logic and memory architectures by changing the on-current and the leakage current. The changes do, however, involve additional mask steps. The first UX4 processing at 0.13-micron design rules will begin next April at Yamagata with a capacity of 6,000 wafers a month. ebnews.com _________________ Goutama