Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Dense Pac Microsystems (DPAC) -- Ignore unavailable to you. Want to Upgrade?

To: Feraldo who wrote (562)	12/6/1999 10:43:00 AM
From: DEER HUNTER	Read Replies (1) \| Respond to of 619

Monday December 6, 8:11 am Eastern Time Company Press Release Dense-Pac Expands Plant to Accommodate Staff Increase Expanding Lease in Present Facility for Operations Growth GARDEN GROVE, Calif.--(BUSINESS WIRE)--Dec. 6, 1999--Dense-Pac Microsystems, Inc. (Nasdaq:DPAC - news), a leading edge provider of high density semiconductor packaging solutions, today announced that it has expanded its current facility by 75 percent by leasing additional space. This move follows Dense-Pac's recent announcement of its plan to increase its operating staff by 60% in response to the growing demand for its high-density technology. The lease is for a term of one year, after which the Company's management intends to re-assess its long-term facility needs. ''The additional space is needed to house the personnel and production-line expansion we initiated in response to the growth Dense-Pac has been experiencing over of the last five quarters,'' commented Ted Bruce, President and Chief Executive Officer of Dense-Pac Microsystems. ''We chose to expand the use of our existing leased facility because it presented the least number of distractions and economic hurdles in the short term; however, we expect to re-examine Dense-Pac's facility needs next summer in relationship to our long-term strategy.'' Dense-Pac Microsystems, Inc. is a technology company that specializes in the design of proprietary and patented three-dimensional high-density packaging. The products allow the company's commercial, industrial, defense and aerospace customers to pack large amounts of memory into small spaces. Its commercial products include applications such as network servers, computers storage devices and medical instrumentation. IDA can include airborne and space avionics and such diverse areas as space satellites and missiles and high performance servers. The Company web site is at www.dense-pac.com. This press release includes forward-looking statements, including statements regarding the Company's market, technology development, expansion and hiring plans, which are subject to change. The actual results may materially differ from those described in any forward-looking statement. Important factors that may cause actual results to differ are set forth in the company's periodic filing with the U.S. Securities and Exchange Commission including its Form 10-KSB for the year ended February 28, 1999. ------------------------------------------------------------------------ Contact: Dense-Pac Microsystems Investor Relations Yvonne Huff, 714/898-0007 yvonneh@dense-pac.com or Wall Street Investor Relations Corp. Joe Zappulla, 301/948-3430 JoeZ@WallStreetIR.com