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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Elmer who wrote (82318)	12/8/1999 8:21:00 AM
From: Bill Jackson	Read Replies (1) \| Respond to of 1577827

Elmer, English must not be your first language. The procedure that you describe is just what I say it is. They use prior test results[This means they know the heat dissipation characteristics of the package into which the die will be inserted...not in there yet] on various dice to get a data base from which they extract their prediction as to what the die they are now testing will plateau at in the package and thus can bin it. A separate thermal test means they take a ready for sale packaged part and[any other test a priori must use a data base as it would fry in under a second as a powered isolated die with no heat sinking] set it up and run it to steady state and then measure what the final temperature is. the procedure you describe is not a true thermal test but a shortcut method of quickly binning parts on the basis of what they expect it's thermal end point to be, based on prior tests. this will be fairly accurate on a statistical basis and also does not need the part to be in it's final package so it is more efficient. Is this then done die by die or is it done on the wafer ? Or are the on wafer tests inherently very low power and used just to select the candidates for test as a die? As for IC test methodology 101....well, why not ask for details. I checked you back ansers and they are dissimilar to this response. I expect hat there are quite a few people who would like some 101 type information on here to place things in perspective. Bill