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To: limtex who wrote (64497)	1/26/2000 12:52:00 PM
From: Eski	Read Replies (1) \| Respond to of 152472

Buy the Rumor Sell the news. That seems to be the way of tech's lately.

To: limtex who wrote (64497)	1/26/2000 12:53:00 PM
From: tech101	Respond to of 152472

Why Don't Invest in the Largest, Behind Scene and Inexpensive, Independent Wireless Chip Packer in the World New deal for AMKR by: huntress_8 1/26/00 12:34 pm Msg: 11087 of 11088 PALM BAY, Fla., Jan 26, 2000 /PRNewswire via COMTEX/ -- Intersil Corporation, the world's leading provider of silicon technology for Wireless Local Area Networks (WLANs), announced today it is incorporating an ultra-thin, small footprint packaging breakthrough by Amkor Technology to further optimize its PRISM II WLAN chipset for high speed, low cost and smaller sized wireless networking devices. Utilizing flush leads, Amkor's MicroLeadFrame (MLF) packaging has a 50 percent smaller footprint and roughly half the parasitic lead inductance of conventional 4.4 mm. TSSOP packages. Reduced electrical parasitics is particularly critical in high frequency RF applications; Intersil expects that MLF packaging can be effectively utilized in WLAN chip sets targeting applications as high as 8GHz. Due to its size, manufacturing cost and RF characteristics, MLF packaging is becoming the package of choice among wireless manufacturers. "By combining Amkor's advanced MLF packaging capabilities with Intersil's silicon integration expertise, the ability to further reduce the size of WLAN card form factors is significantly improved," said Larry Ciaccia, vice president and general manager of PRISM Wireless Products at Intersil. "This effort is driven by the market's need for smallest size, lowest cost WLAN form factors and easiest-to-build solutions for cutting-edge wireless products. Intersil is poised to meet this demand through a very aggressive chip set integration roadmap resulting in continuous performance improvements and higher levels of integration -- and advanced packaging solutions are a key component to this process." "The combination of excellent RF performance and low cost in Amkor's Micro LeadFrame packaging complements Intersil's advanced silicon germanium (SiGe) process technology," said Terry Davis, Amkor's MLF product manager. "The package is the interface between the chip and the system board, and to make a product such as PRISM II successful, it must be engineered so that it does not compromise the performance of the IC, while at the same time provide a rugged, reliable, and cost-effective interconnect." In addition to a substantially smaller footprint, MLF packaging significantly reduces package profile height (< OR = 1 mm.), enabling WLAN products to be incorporated into emerging thin profile modules. Thinner- profile packages are particularly useful in the design of wireless PCMCIA cards; today's cards require chips built into both sides of the board. MLF packages will enable one-sided PCMCIA PWB surface mount assemblies, thus reducing OEM manufacturing costs. Initial designs with Amkor's MLF technology have resulted in a 75 percent footprint reduction (16 mm. SQ vs. 62 mm. SQ) in the PRISM HFA3983 Power Amplifier. MLF designs are also in progress for the RF and IF functions of the chip set's RF front end. Intersil's Baseband Processor and Medium Access Controller (MAC) product families will incorporate Ball Grid Array (BGA) packaging, which also significantly reduces the footprint size and opens the door for small form factor WLAN modules. About PRISM II Intersil's PRISM II Chip Set is the world's most complete silicon solution for the design of Wireless Local Area Networks (WLANs). Comprised of five highly integrated ICs incorporating advanced silicon germanium (SiGe) and sub-micron CMOS technology, PRISM II delivers all the required analog and digital circuitry for the PHY and MAC layers, providing a complete, "antenna- to-computer" solution for high-data rate WLANs. PRISM II has been chosen by the world's leading telecom, networking, and computer companies as a key part of high performance wireless products for home or office. messages.yahoo.com

To: limtex who wrote (64497)	1/26/2000 1:23:00 PM
From: Didi	Respond to of 152472

limtex, Brilliant, what a post! Surprised about the analysts? Neither will they see, nore look beyond the obvious. Witnessed this repeated pattern at uncle Warren's annual BRK sermons. Good luck, lim. di