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To: John Stewart who wrote (2655)	2/14/2000 9:16:00 PM
From: lrrp	Read Replies (2) \| Respond to of 3661

Taken from the amat thread: What I was wondering, if anyone is in the field or who knows; what is the difference between mattson's cvd vs say amat and novellus? I know that both amat and nvls have high density cvd; do we know if mattson has this , thanks steve To: Gottfried who wrote (34222) From: Brian Kerecz Monday, Feb 14, 2000 9:39 AM ET Reply # of 34229 Taiwan's UMC Orders Multiple Ultima HDP-CVD Systems from Applied Materials for Production of High Performance Chips Low(kappa) Dielectric FSG(TM) Process Capability Is Key Factor in Foundry's Decision Applied Materials, Inc. (Nasdaq:AMAT - news) today announced that United Microelectronics Corp. (UMC), the world's second largest semiconductor foundry, has ordered multiple Ultima HDP-CVD(TM) Centura® systems for installation in its newest Fab 8F and Fab 8D facilities located in Hsinchu, Taiwan. The systems, currently being shipped, will be used to deposit FSG (fluorinated silicate glass) as a low dielectric constant ((kappa)) material in the interconnect structures of advanced 0.18-micron devices. FSG is a first-generation low (kappa) film that allows customers to increase device speeds by enabling denser chip circuitry. The Ultima will also be used by UMC to deposit USG (undoped silicate glass) film in interconnect and shallow trench isolation structures. 'The Ultima system's advanced capabilities have enhanced our ability to manufacture some of the world's most complex, high-performance chips,' stated Dr. J.J. Lee, deputy director for Fab 8D of UMC. 'The Ultima's FSG low (kappa) gap fill process was a critical factor in its selection. The system's manufacturing reliability and process flexibility were also important factors for our cost-sensitive foundry operations. The Ultima system's versatility will allow us to extend the HDP-CVD process capability across multiple device generations and rapidly meet next-generation requirements.' The Ultima HDP-CVD Centura is the semiconductor industry's most advanced high-density plasma CVD system for depositing dielectric films. The Ultima is widely used for a variety of dielectric applications including intermetal dielectric, pre-metal dielectric, shallow trench isolation and passivation film layers, and is the industry's only system being used for volume production of FSG low k dielectric films at multiple customer sites. Strong customer acceptance of the Ultima system has established Applied Materials as the world's leading supplier of HDP-CVD equipment. According to industry research firm VLSI Research Inc., the market for HDP-CVD systems is forecast to grow from $587 million in 1999 to $1.85 billion in 2004, representing a compounded annual growth rate of 25.8 percent. 'UMC's selection of the Ultima HDP-CVD Centura for its leading-edge, high-volume manufacturing facility is a major endorsement of our system,' said Dr. Farhad Moghadam, vice president and general manager of Applied Materials' Dielectric Systems and Modules Product Group. 'The Ultima system's cost-effectiveness and reliability have made it a very successful product, especially for foundry operations.' In addition to advanced film deposition capability, the Ultima HDP-CVD Centura features Applied Materials' Remote Clean(TM) technology which reduces operating costs by eliminating chamber consumables and significantly extending system uptime. Using this technology, the Ultima emits virtually no global warming gases. As a result of this achievement, the U.S. Environmental Protection Agency recently recognized Applied Materials' Remote Clean technology with a 1999 Climate Protection Award. Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market System under the symbol 'AMAT.' Applied Materials' web site is www.appliedmaterials.com. View Replies (1) \| View Next 10 Messages \| Respond \| Previous \| Next Remove SubjectMark Ignore this Person View SubjectMarks AMAT: APPLIED MATERIALS(NASDAQ) Monday, Feb