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To: kinkblot who wrote (4)	5/2/2000 7:41:00 PM
From: John Finley	Read Replies (1) \| Respond to of 83

The thin layer is separated by application of mechanical force. That sounds scary. It think I liked the plain ol' thermal separation better (but it is more thermally limiting) Thanks for putting up all this information here, Will. Is there an ADR? Or did you already mention that? JF

To: kinkblot who wrote (4)	5/3/2000 9:01:00 PM
From: kinkblot	Read Replies (2) \| Respond to of 83

SOITEC Financial Presentation, First Half FY2000 This presentation was introduced to analysts and investors in December 1999 to accompany the first 6 months of the financial year ended March 31, 2000. soitec.com See page 8 - Announced Smart-Cut® applications: GEMPLUS Memory Capability x 50 and Consumption /10 for Smart Cards (Dec 98) KOPIN High resolution and brightness, low consumption for CyberScreens for Digital Camera and Cellular Phones (l'Ordinateur Individuel, August 99) [the picture of a cell phone with eyepiece is similar to one on Kopin's website] The CyberDisplay is a transmissive AMLCD microdisplay. This type of display is enabled by a thin, transparent monocrystalline Si layer with integrated pixel control circuitry. Lowest cost production is achieved when the ICs can be fabricated by standard semiconductor production processes, which is only possible before the layer is lifted off and transferred from donor wafer to glass. This an example of an application in which the customer processes the thin top layer before separating it. Perhaps the wafers for this application are produced after the method of US Patent 6,020,252? Kopin previously made their own wafers for lift-off using an epitaxial process. The fact that they've shifted to Smart-Cut® is a nice endorsement for SOITEC. The Gemplus smart card application is a more typical one: ICs on SOI substrates. WT