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To: Bilow who wrote (42374)	5/16/2000 8:53:00 PM
From: jim kelley	Read Replies (1) \| Respond to of 93625

Re: In brief, the memory industry doesn't have to predict DDR consumption 3 months in advance, like it does RDRAM production, in order to schedule chip starts. Silly guy! Of course they do have to schedule! These different memory types compete for the same production resources. If you said they could divert SDRAM starts into DDR sdram that would be correct. But they still have to schedule the production resources. In fact, Samsung said this week that they would shift production from SDRAM to RDRAM preferentially if there is a supply problem later in the year. :)

To: Bilow who wrote (42374)	5/16/2000 8:59:00 PM
From: jim kelley	Respond to of 93625

Carl Hope you have fun building a 128 bit memory out of 64M X 4 memory components. <G>

To: Bilow who wrote (42374)	5/17/2000 7:27:00 AM
From: John Walliker	Read Replies (1) \| Respond to of 93625

Carl, The x4, x8, and x16 chips don't have to be specified until about 2 weeks before shipping. Until then, the material in progress is identical to SDRAM. So the memory industry is in perfect condition to do a surprise ramp of DDR SDRAM at about 2 weeks notice. That is what all those articles about DDR being a simple final metal layer mask difference from SDRAM were all about. Just to make sure I understand correctly. SDRAM currently being manufactured already has the additional circuits needed for DDR diffused into the silicon. All the manufacturers have to do is to change the metallisation to bring these extra circuits into operation. The manufacturing process from changing the masks, through wafer metallisation, wafer scribing, packaging and testing all takes less than 2 weeks, including any shipping between facilities. The x4 and x8 DDR chips all have the i/o pad ESD protection circuits and buffer transistors diffused the same as for x16, but the unwanted pads and associated circuitry are not used if not required. Is all that right? John