To: BostonView who wrote (1729 ) 5/18/2000 10:49:00 PM From: Jim Oravetz Respond to of 2882
IMO, $300M is not that much for capital spending. Intel is spending north of $1.3B. Granted they have X10 the revenue. A state of the art lithography machine runs $8-10M each. A full up new fab runs $1-2B. FWIW, check out the Semi - "Blood in the streets" thread or Semi Business News for some recent posts on capital spending info. Again from the 1998 Annual report, ADI claimed that they had increased production capacity to meet demand. I think that much of that capacity went into packaging and test in the Far East. While you need this, having readily available wafers and good die are more important. TSMC has increased capacity and had locked in production runs for ADI. Hopefully, this will pay off. As I indicated before, some ADI parts are way out there in delivery. Maybe if your an Lucent, HP or such you have contracts that get you parts. My company is not that big. We are designing out ADI parts because we can not get them! Re: TXN. While ADI is touting it horn on design wins. TI is still king with roughly 45% of the market. ADI was hovering around 12-14%, behind MOT/LU. DSP is hot. TXN has locked in several major phone deals with some new DSP's. Phone production is just exploding with new technologies and upward usage trends. TXN will do well. Edit:Message 13538154 "In 1999, TSMC's annual capacity was 1.8 million eight-inch equivalent wafers. By the end of 2000, that number is expected to reach 3.4 million wafers," said F.C. Tseng, president, TSMC. "This increase is in direct response to the industry's rising demand for pure-play foundry services. TSMC has been aggressively expanding to meet that demand through fab creation, mergers, and capital investments. In 2000 alone, TSMC's capital expenditures will rival nearly every other semiconductor manufacturer in the world." Jim