Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Fred Levine who wrote (35397)	5/29/2000 10:46:00 PM
From: Dr. Mitchell R. White	Read Replies (1) \| Respond to of 70976

Interesting post, Fred! Thanks! (And I think you beat Brian to the punch. <g> ) Thailand buying back into the game! A 26% cap on outside investment (I'm assuming that's total, not per-partner), but strong names to attach some credibility to the project. Starts of 25K-30K wafers per month indicates they're thinking 200mm gear. (This many starts at 300mm would require about a $3 billion fab, I think. Unless they're talking "200mm equivalents" or something.) They could buy new, of course, or maybe this is a way for Intel, etc. to speed up their conversion to 300mm at other plants; just send the usable, but mostly depreciated, 200mm gear over to the Thai project and backfill with larger form factor tools. I don't know what the economics of that would be, but it sounds intriguing to somebody on the outside. Either way, AMAT should get a shot at up to $400MM on this one! I wonder how much they'll actually get.... Mitch

To: Fred Levine who wrote (35397)	5/30/2000 8:58:00 AM
From: Proud_Infidel	Read Replies (2) \| Respond to of 70976

Applied Materials Launches Sprint Tungsten CVD Centura for Multi-Generation DRAM, Logic Chips Unique High Pressure, Low Temperature Process Enables High Device Yields SANTA CLARA, Calif.--(BUSINESS WIRE)--May 30, 2000--Applied Materials, Inc., the leading provider of tungsten chemical vapor deposition (CVD) systems to the global semiconductor industry, introduces the Sprint(TM) Tungsten CVD Centura©. The system's unique high pressure tungsten deposition process enables void-free filling of critical contact and via structures in 0.18 micron and below chip designs to permit high device yields. ``Conventional tungsten CVD processes are reaching a limit in their ability to fill the tight geometries presented by advanced chip designs. Voids in tungsten plugs have been linked to problems such as post-CMP yield losses and high contact resistance,'' said Dr. Moris Kori, vice president and general manager of Applied Materials' Liner/Barrier & Tungsten Systems Product Group. ``Our single wafer chamber design allows us to raise the deposition pressure in order to achieve complete plug fill while maintaining high system throughput. We expect Sprint's advanced capabilities to play a key part in the progression to 0.13 micron and beyond logic and DRAM devices.'' A key feature of the Sprint system is its dual-pressure process that begins with a low pressure nucleation step for growing a thin tungsten seed layer. The system then switches to a high pressure (300 Torr) regime for void-free bulk-fill of the contact and via structures at a throughput of more than 60 wafers per hour (wph). Wafer temperature remains below 400(degree)C at all times, further increasing device reliability and ensuring compatibility with advanced low k dielectrics. The Sprint system also has several features that contribute to lowering the cost of system operation in customers' fabs, including Applied Materials' Remote Clean(TM) technology that generates virtually no global warming gases. A new wafer pedestal heater uses a detachable ceramic purge ring to allow easy serviceability and long process kit lifetime, as well as reduced in situ clean times and gas consumption compared to prior technologies. ``The benefits of the Sprint Centura have already been demonstrated at customer sites, resulting in multiple new orders,'' noted Dr. Sergio Edelstein, general manager of Applied Materials' Tungsten Systems Division. ``A leading DRAM manufacturer has had excellent results using the Sprint system for its 0.18 micron, 4th-generation 128Mb design. Overcoming problems found with competing tungsten processes, Sprint's 300 Torr process allowed the customer to dramatically lower contact resistance and achieve higher device yields.'' A 300mm version of the Sprint is also available, featuring a number of advancements to further increase system productivity. A 300mm system has already been shipped to a leading semiconductor manufacturer in Asia and several more are expected to ship before the end of the year. According to market research firm, Dataquest, the market for tungsten CVD equipment is expected to exceed $500 million in 2000 and grow to $590 million by the year 2002. Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the NASDAQ National Market System under the symbol ``AMAT''. Applied Materials' web site is www.appliedmaterials.com